公开(公告)号：US20230035716A1

公开(公告)日：2023-02-02

申请号：US17387794

申请日：2021-07-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Rajen Manicon MURUGAN ,  Li JIANG

IPC: H01L23/498 ,  H01L23/13 ,  H01P3/02 ,  H05K1/02

Abstract: In examples, a semiconductor package comprises a ceramic substrate and a horizontal metal layer covered by the ceramic substrate. The metal layer is configured to carry signals in the 5 GHz to 38 GHz frequency range. The package also includes a vertical castellation on an outer surface of the ceramic substrate, the castellation coupled to the metal layer and having a height ranging from 0.10 mm to 0.65 mm.

公开(公告)号：US20220384369A1

公开(公告)日：2022-12-01

申请号：US17335010

申请日：2021-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Li JIANG ,  Rajen Manicon MURUGAN

IPC: H01L23/58 ,  H01L23/552 ,  H01L23/00

Abstract: In examples, a semiconductor package comprises a ceramic substrate and first and second metal layers covered by the ceramic substrate. The first metal layer is configured to carry signals at least in a 20 GHz to 28 GHz frequency range. The package comprises a semiconductor die positioned above the first and second metal layers and coupled to the first metal layer. The package comprises a ground shield positioned in a horizontal plane between the semiconductor die and the first metal layer, the ground shield including an orifice above a portion of the first metal layer. The package includes a metal seal ring coupled to a top surface of the ceramic substrate, the metal seal ring having a segment that is vertically aligned with a segment of the ground shield. The segment of the ground shield is between the orifice of the ground shield and a horizontal center of the ground shield. The package comprises a metal lid coupled to a top surface of the metal seal ring.

公开(公告)号：US20230197642A1

公开(公告)日：2023-06-22

申请号：US18172208

申请日：2023-02-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yiqi TANG ,  Li JIANG ,  Rajen Manicon MURUGAN

IPC: H01L23/58 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L23/585 ,  H01L23/564 ,  H01L23/562 ,  H01L23/552

Abstract: In examples, a semiconductor package comprises a ceramic substrate and first and second metal layers covered by the ceramic substrate. The first metal layer is configured to carry signals at least in a 20 GHz to 28 GHz frequency range. The package comprises a semiconductor die positioned above the first and second metal layers and coupled to the first metal layer. The package comprises a ground shield positioned in a horizontal plane between the semiconductor die and the first metal layer, the ground shield including an orifice above a portion of the first metal layer. The package includes a metal seal ring coupled to a top surface of the ceramic substrate, the metal seal ring having a segment that is vertically aligned with a segment of the ground shield. The segment of the ground shield is between the orifice of the ground shield and a horizontal center of the ground shield. The package comprises a metal lid coupled to a top surface of the metal seal ring.