公开(公告)号：US10672692B2

公开(公告)日：2020-06-02

申请号：US15820266

申请日：2017-11-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory Williamson ,  Bernardo Gallegos ,  Jose Carlos Arroyo

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

Abstract: A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.

公开(公告)号：US20190279944A1

公开(公告)日：2019-09-12

申请号：US16427150

申请日：2019-05-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal M. Williamson ,  Nima Shahidi ,  Jose Carlos Arroyo

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

Abstract: An assembly (101) comprising a semiconductor device (110) with solderable bumps (112); a substrate (120) with a layer (130) of a first insulating compound and an underlying metal layer (140) patterned in contact pads (141) and connecting traces (142), the insulating layer having openings (132) to expose the surface (142a) and sidewalls (142b) of underlying traces; the device bumps soldered onto the contact pads, establishing a gap (150) between device and top insulating layer; and a second insulating compound (160) cohesively filling the gap and the second openings, thereby touching the underlying traces, the second insulating compound having a higher glass transition temperature, a higher modulus, and a lower coefficient of thermal expansion than the first insulating compound.

公开(公告)号：US20180096859A1

公开(公告)日：2018-04-05

申请号：US15282534

申请日：2016-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory Williamson ,  Bernardo Gallegos ,  Jose Carlos Arroyo

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/4832 ,  H01L21/4821 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49586 ,  H01L23/49861 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.