公开(公告)号：US11259441B2

公开(公告)日：2022-02-22

申请号：US16981169

申请日：2019-03-20

Applicant: Sony Interactive Entertainment Inc.

Inventor： Satoshi Mito ,  Yasuhiro Ootori ,  Keiichi Aoki

IPC: H05K7/20 ,  H05K5/02 ,  G06F1/20

Abstract: Foreign matter is prevented from entering the inside of an electronic apparatus. An electronic apparatus (100) includes plural exhaust holes (E1, E2) formed in an armor member (20), an air flow path (S3) formed inside the armor member (20) and connected to the plural exhaust holes (E1, E2), a power source circuit (41) disposed in the air flow path (S3), and a foreign matter preventing member (70) located between the power source circuit (41) and the plural exhaust holes (E1, E2). The foreign matter preventing member (70) is formed with plural openings (Es). Each of the openings (Es) is smaller in size than each of the exhaust holes (E1, E2).

公开(公告)号：US10278303B2

公开(公告)日：2019-04-30

申请号：US15661203

申请日：2017-07-27

Applicant: Sony Interactive Entertainment Inc.

Inventor： Yuta Tamaki ,  Yasuhiro Ootori

IPC: H05K7/20 ,  A63F13/90

Abstract: An electronic apparatus includes a first member having an opening through which air passes, the opening in a first direction, and a second member mounted to an outside of the first member. The second member includes a plurality of guide portions disposed in juxtaposition with each other in a second direction that extends orthogonally to the first direction when viewed in the first direction, the guide portions guiding air flowing through the opening. At least one guide portion out of the plurality of guide portions includes an engagement portion to be hooked onto the first member. The second member is mounted to the first member through the engagement portion.

公开(公告)号：US20180228035A1

公开(公告)日：2018-08-09

申请号：US15941158

申请日：2018-03-30

Applicant: Sony Interactive Entertainment Inc.

Inventor： Yukito Inoue ,  Yasuhiro Ootori

IPC: H05K5/00 ,  H05K7/20 ,  H05K5/03 ,  H05K7/14

CPC classification number: H05K5/0008 ,  A63F13/90 ,  G06F1/181 ,  G06F1/20 ,  H05K5/0004 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/1427 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20181

Abstract: A plurality of parts built in an electronic apparatus (1) are attached to a frame (20). Further, the frame (20) has a peripheral wall portion (21, 22, 23) formed along an outer peripheral face of the electronic apparatus (1). An upper cover (30) has a rear face portion (32) attached to a rear wall portion (23) of the frame (20) by a screw. Further, a lower cover (40) has a rear face portion (43) attached to the rear wall portion (23) of the frame (20) by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.

公开(公告)号：US12075593B2

公开(公告)日：2024-08-27

申请号：US17910485

申请日：2020-09-24

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Keiichi Aoki ,  Yasuhiro Ootori ,  Yuta Tamaki ,  Mitsuharu Morishita

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20336 ,  H05K7/2039

Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.

公开(公告)号：US11985766B2

公开(公告)日：2024-05-14

申请号：US17910876

申请日：2021-03-23

Applicant: Sony Interactive Entertainment Inc.

Inventor： Katsushi Ito ,  Yasuhiro Ootori ,  Nobuyuki Sugawara

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/10159 ,  H05K2201/10371

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

公开(公告)号：US20230345665A1

公开(公告)日：2023-10-26

申请号：US18249573

申请日：2021-11-01

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Masanori Hayashibara ,  Yasuhiro Ootori ,  Keiichi Aoki

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20136

Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.

公开(公告)号：US11262810B2

公开(公告)日：2022-03-01

申请号：US17201307

申请日：2021-03-15

Applicant: Sony Interactive Entertainment Inc.

Inventor： Yujin Morisawa ,  Kazutaka Eto ,  Yasuhiro Ootori ,  Yuta Tamaki ,  Toshihiro Ueda

IPC: G06F1/18 ,  H05K7/20 ,  G06F1/20 ,  H05K5/00

Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.

公开(公告)号：US10820431B2

公开(公告)日：2020-10-27

申请号：US16086452

申请日：2017-02-10

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: H05K5/02 ,  H05K7/20 ,  G06F1/20 ,  G11B33/14 ,  G11B33/02

Abstract: The ventilation efficiency is improved while exposure of a part disposed at the inner side of an electronic apparatus is suppressed. An electronic apparatus has a first shielding portion and a second shielding portion disposed behind a circuit board. The first shielding portion and the second shielding portion are juxtaposed in an upward and downward direction. Further, the first shielding portion and the second shielding portion are disposed in a displaced relationship from each other in a forward and rearward direction, and a first exhaust port is provided between the first shielding portion and the second shielding portion.

公开(公告)号：US20190132969A1

公开(公告)日：2019-05-02

申请号：US16086452

申请日：2017-02-10

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kenji Hirose ,  Shinya Tsuchida ,  Yasuhiro Ootori

IPC: H05K5/02 ,  G11B33/14 ,  H05K7/20

Abstract: The ventilation efficiency is improved while exposure of a part disposed at the inner side of an electronic apparatus is suppressed. An electronic apparatus has a first shielding portion and a second shielding portion disposed behind a circuit board. The first shielding portion and the second shielding portion are juxtaposed in an upward and downward direction. Further, the first shielding portion and the second shielding portion are disposed in a displaced relationship from each other in a forward and rearward direction, and a first exhaust port is provided between the first shielding portion and the second shielding portion.

公开(公告)号：US09955593B2

公开(公告)日：2018-04-24

申请号：US15466877

申请日：2017-03-23

Applicant: SONY INTERACTIVE ENTERTAINMENT INC.

Inventor： Yukito Inoue ,  Yasuhiro Ootori

IPC: H05K5/00 ,  H05K7/00 ,  H05K5/03 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K5/0008 ,  A63F13/90 ,  G06F1/181 ,  G06F1/20 ,  H05K5/0004 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/1427 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20181

Abstract: A plurality of parts built in an electronic apparatus are attached to a frame. Further, the frame has a peripheral wall portion formed along an outer peripheral face of the electronic apparatus. An upper cover has a rear face portion attached to a rear wall portion of the frame by a screw. Further, a lower cover has a rear face portion attached to the rear wall portion of the frame by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.