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    DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
    11.
    发明申请
    DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME 有权

    公开(公告)号：US20210057401A1

    公开(公告)日：2021-02-25

    申请号：US16998118

    申请日：2020-08-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongyeob Lee ,  Doyoung Kwag ,  Sangmoo Park ,  Seona Yang ,  Yoonsuk Lee

    IPC: H01L25/16

    Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.

    Display module and display apparatus having the same
    15.
    发明授权
    Display module and display apparatus having the same 有权

    公开(公告)号：US11437356B2

    公开(公告)日：2022-09-06

    申请号：US16998118

    申请日：2020-08-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongyeob Lee ,  Doyoung Kwag ,  Sangmoo Park ,  Seona Yang ,  Yoonsuk Lee

    IPC: H01L31/036 ,  H01L29/15 ,  H01L29/04 ,  H01L27/14 ,  H01L25/16

    Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.

    LED TRANSFER DEVICE COMPRISING MASK AND MICRO LED TRANSFERRING METHOD USING THE SAME
    16.
    发明申请
    LED TRANSFER DEVICE COMPRISING MASK AND MICRO LED TRANSFERRING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20200161159A1

    公开(公告)日：2020-05-21

    申请号：US16682111

    申请日：2019-11-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangmoo PARK ,  Doyoung Kwag ,  Eunhye Kim ,  Minsub Oh ,  Yoonsuk Lee

    IPC: H01L21/683 ,  H01L21/67 ,  H01L33/62

    Abstract: A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

    Compression bonding apparatus
    19.
    发明授权
    Compression bonding apparatus 有权

    公开(公告)号：US11469343B2

    公开(公告)日：2022-10-11

    申请号：US16768492

    申请日：2019-01-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk Lee ,  Doyoung Kwag ,  Sangmoo Park

    IPC: H01L33/00 ,  H01L33/56 ,  H01L21/683

    Abstract: A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.

    Micro LED transfer device and micro led transferring method using the same
    20.
    发明授权
    Micro LED transfer device and micro led transferring method using the same 有权

    公开(公告)号：US11289622B2

    公开(公告)日：2022-03-29

    申请号：US16832884

    申请日：2020-03-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk Lee ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

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