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11.
公开(公告)号:US20240297215A1
公开(公告)日:2024-09-05
申请号:US18658794
申请日:2024-05-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungkeun Lim , Unki Kim , Yuyeong Jo , Yihwan Kim , Jinbum Kim , Pankwi Park , Ilgyou Shin , Seunghun Lee
CPC classification number: H01L29/0638 , H01L21/0245 , H01L29/66545 , H01L29/66795 , H01L29/785
Abstract: A semiconductor device includes; an active region; an isolation region defining the active region; a barrier layer on the active region; an upper semiconductor layer on the barrier layer; and a gate structure covering an upper surface, a lower surface, and side surfaces of the upper semiconductor layer in a first direction. The first direction is a direction parallel to an upper surface of the active region, and the barrier layer is disposed between the gate structure and the active region.
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公开(公告)号:US11996443B2
公开(公告)日:2024-05-28
申请号:US17729676
申请日:2022-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungkeun Lim , Unki Kim , Yuyeong Jo , Yihwan Kim , Jinbum Kim , Pankwi Park , Ilgyou Shin , Seunghun Lee
CPC classification number: H01L29/0638 , H01L21/0245 , H01L29/66545 , H01L29/66795 , H01L29/785
Abstract: A semiconductor device includes; an active region; an isolation region defining the active region; a barrier layer on the active region; an upper semiconductor layer on the barrier layer; and a gate structure covering an upper surface, a lower surface, and side surfaces of the upper semiconductor layer in a first direction. The first direction is a direction parallel to an upper surface of the active region, and the barrier layer is disposed between the gate structure and the active region.
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公开(公告)号:US20220254878A1
公开(公告)日:2022-08-11
申请号:US17729676
申请日:2022-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungkeun Lim , Unki Kim , Yuyeong Jo , Yihwan Kim , Jinbum Kim , Pankwi Park , Ilgyou Shin , Seunghun Lee
Abstract: A semiconductor device includes; an active region; an isolation region defining the active region; a barrier layer on the active region; an upper semiconductor layer on the barrier layer; and a gate structure covering an upper surface, a lower surface, and side surfaces of the upper semiconductor layer in a first direction. The first direction is a direction parallel to an upper surface of the active region, and the barrier layer is disposed between the gate structure and the active region.
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公开(公告)号:US10304834B2
公开(公告)日:2019-05-28
申请号:US15939914
申请日:2018-03-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangmoon Lee , Jungtaek Kim , Yihwan Kim , Woo Bin Song , Dongsuk Shin , Seung Ryul Lee
IPC: H01L29/78 , H01L27/092 , H01L21/84 , H01L29/66 , H01L21/8238 , H01L27/088 , H01L27/12
Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a substrate; an active pattern spaced apart from the substrate and extending in a first direction; and a gate structure on the active pattern and extending in a second direction crossing the first direction, wherein a lower portion of the active pattern extends in the first direction and includes a first lower surface that is sloped with respect to an upper surface of the substrate.
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