公开(公告)号：US20220223385A1

公开(公告)日：2022-07-14

申请号：US17466184

申请日：2021-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sejin Oh ,  Iksu Byun ,  Taemin Earmme ,  Jongwoo Sun ,  Jewoo Han

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/311

Abstract: A plasma processing apparatus includes: an electrostatic chuck supporting a wafer, and connected to a first power supply, an edge ring disposed to surround an edge of the electrostatic chuck and formed of a material having a first resistivity value, a dielectric ring supporting a lower portion of the edge ring, formed of a material having a second resistivity value lower than that of the first resistivity value, and connected to a second power supply, and an electrode ring disposed in a region overlapping the dielectric ring, in contact with a lower surface of the edge ring, and formed of a material having a third resistivity value greater than the first resistivity value, wherein the third resistivity value is a value of 90 Ωcm to 1000 Ωcm.

公开(公告)号：US12224214B2

公开(公告)日：2025-02-11

申请号：US18416585

申请日：2024-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongkeun Cho ,  Eunhee Jeang ,  Jihun Lee ,  Gyumin Jeong ,  Hyunjae Kang ,  Taemin Earmme

IPC: H01L21/66 ,  H01L21/311

Abstract: A method of fabricating a semiconductor device is disclosed. The method may include forming a parent pattern, forming an upper thin film on the parent pattern, forming a child pattern on the upper thin film, measuring a diffraction light from the parent and child patterns to obtain an intensity difference curve of the diffraction light versus its wavelength, and performing an overlay measurement process on the parent and child patterns using the diffraction light, which has the same wavelength as a peak of the intensity difference curve located near a peak of reflectance of the parent and child patterns, to obtain an overlay measurement value.

公开(公告)号：US11964357B2

公开(公告)日：2024-04-23

申请号：US17857289

申请日：2022-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungchul Han ,  Yonghee Lee ,  Taemin Earmme ,  Byoungho Kwon ,  Kuntack Lee

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

公开(公告)号：US11955387B2

公开(公告)日：2024-04-09

申请号：US17386323

申请日：2021-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongkeun Cho ,  Eunhee Jeang ,  Jihun Lee ,  Gyumin Jeong ,  Hyunjae Kang ,  Taemin Earmme

IPC: H01L21/66 ,  H01L21/311

CPC classification number: H01L22/12 ,  H01L21/31144

Abstract: A method of fabricating a semiconductor device is disclosed. The method may include forming a parent pattern, forming an upper thin film on the parent pattern, forming a child pattern on the upper thin film, measuring a diffraction light from the parent and child patterns to obtain an intensity difference curve of the diffraction light versus its wavelength, and performing an overlay measurement process on the parent and child patterns using the diffraction light, which has the same wavelength as a peak of the intensity difference curve located near a peak of reflectance of the parent and child patterns, to obtain an overlay measurement value.

公开(公告)号：US11590628B2

公开(公告)日：2023-02-28

申请号：US16747034

申请日：2020-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghee Lee ,  Yungjun Kim ,  Hyunjoon Park ,  Taemin Earmme ,  Seungchul Han ,  Byoungho Kwon ,  Kuntack Lee

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/30

Abstract: A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.