公开(公告)号：US11726620B2

公开(公告)日：2023-08-15

申请号：US17673053

申请日：2022-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk Kim ,  Younghak Park ,  Joosung Kim ,  Doil Ku ,  Younggil Gi ,  Yonghee Yang ,  Youngsub Lee

IPC: G06F3/044 ,  H04B1/40

CPC classification number: G06F3/044 ,  G06F2203/04112 ,  H04B1/40

Abstract: According to various embodiments of the disclosure, an electronic device may comprise: a housing including: a first surface, a second surface facing in a direction opposite to the first surface, and a side surface at least partially surrounding a space between the first surface and the second surface; a printed circuit board disposed between the first surface and the second surface; a first sensing element including a plurality of conductive vias arranged in parallel to the side surface in at least a portion of an edge of the printed circuit board; and a grip sensor electrically connected with the first sensing element. The grip sensor may be configured to detect a change in capacitance due to an approach or contact state of an external object to the housing, in at least a portion of the side surface of the housing using the first sensing element.

公开(公告)号：US11367944B2

公开(公告)日：2022-06-21

申请号：US16861800

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyu Kim ,  Kyungbae Ko ,  Un Kim ,  Sanguk Kim ,  Donghwan Kim ,  Yongsub Lee

IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K1/02 ,  H01Q1/50 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q5/20

Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

公开(公告)号：US11282795B2

公开(公告)日：2022-03-22

申请号：US16929956

申请日：2020-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk Kim

IPC: H01L23/495 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower surfaces of the frame and the inner semiconductor chip. The lower re-distribution layer has an opening therein which at least partially exposes the lower surface of the inner semiconductor chip. A lower semiconductor chip is provided, which extends adjacent the lower surface of the inner semiconductor chip, and within the opening in the lower re-distribution layer. This lower re-distribution layer includes: (i) an insulating layer covering the lower surface of the frame, (ii) a re-distribution pattern disposed on the insulating layer, and (iii) a barrier layer, which is disposed on the insulating layer and surrounds at least a portion of the lower semiconductor chip.

公开(公告)号：US11239219B2

公开(公告)日：2022-02-01

申请号：US16816555

申请日：2020-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk Kim

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/64

Abstract: A semiconductor package including a lower redistribution layer including wiring patterns; a lower substrate on the lower redistribution layer, the lower substrate including a cavity; an application processor on the lower redistribution layer in the cavity; a cache memory chip on the application processor; a passive device module on the application processor; a plurality of first through-silicon vias penetrating the application processor to connect the lower redistribution layer to the passive device module; and lower bumps on a bottom surface of the lower redistribution layer, wherein the passive device module is adjacent to a side of the cache memory chip.

公开(公告)号：US10812117B2

公开(公告)日：2020-10-20

申请号：US16491667

申请日：2018-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk Kim ,  Sangsoon Kim ,  Taekho Lee ,  Hyoseok Na

IPC: H04B17/12 ,  H01Q5/335 ,  H04B1/00 ,  H01Q1/24 ,  H04B1/401

Abstract: Various embodiments of the present invention relate to an electronic device including an antenna impedance matching circuit. The electronic device may comprise: at least one interface; at least one detection circuit for detecting a connection of at least one external device to the at least one interface; at least two matching circuits; an antenna; and a switch module for receiving, from the at least one detection circuit, at least one signal corresponding to whether the at least one external device is connected to the at least one interface, and for connecting the antenna to a matching circuit, among the at least two matching circuits, corresponding to the at least one signal. Various other embodiments are also possible.