公开(公告)号：US20210202787A1

公开(公告)日：2021-07-01

申请号：US17133171

申请日：2020-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.

公开(公告)号：US20200335659A1

公开(公告)日：2020-10-22

申请号：US16850645

申请日：2020-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo PARK ,  Minsub Oh ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/24

Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.

公开(公告)号：US20200020740A1

公开(公告)日：2020-01-16

申请号：US16426846

申请日：2019-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/15 ,  H01L33/00 ,  G01N21/95 ,  H01L21/66

Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.

公开(公告)号：US20220384675A1

公开(公告)日：2022-12-01

申请号：US17885164

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for repairing a display module and a display module repaired by the method are provided. The method for repairing a display module includes: detecting light-emitting diode (LED) missing positions on a target substrate; loading the target substrate onto a first stage; loading a transfer substrate onto a second stage; arranging the target substrate and the transfer substrate by operating the first stage and the second stage; and transferring a laser consecutively to the LED missing positions by moving the target substrate and the transfer substrate at a constant speed by operating the first stage and the second stage in a row direction or a column direction.

公开(公告)号：US20220181311A1

公开(公告)日：2022-06-09

申请号：US17677182

申请日：2022-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/13 ,  H01L33/00

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US20210358896A1

公开(公告)日：2021-11-18

申请号：US17244471

申请日：2021-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Dongyeob LEE

IPC: H01L25/16 ,  H01L23/00

Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.

公开(公告)号：US20210110748A1

公开(公告)日：2021-04-15

申请号：US17070581

申请日：2020-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH

IPC: G09G3/00 ,  H01L33/62 ,  H01L33/38 ,  H01L27/15

Abstract: A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.

公开(公告)号：US20210057258A1

公开(公告)日：2021-02-25

申请号：US16929311

申请日：2020-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62 ,  B23K26/08 ,  B23K26/04 ,  B23K26/03

Abstract: The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

公开(公告)号：US20200243358A1

公开(公告)日：2020-07-30

申请号：US16731468

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.

公开(公告)号：US20250096177A1

公开(公告)日：2025-03-20

申请号：US18962923

申请日：2024-11-27

Applicant: SAMSUNG ELECTRONICS CO, LTD

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Dongyeob LEE ,  Sangmoo PARK

IPC: H01L23/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes of the substrate may be bonded by eutectic bonding through the assembly during thermal compression bonding.