公开(公告)号：US20210288209A1

公开(公告)日：2021-09-16

申请号：US17258061

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Minsub OH ,  Sangmoo PARK ,  Eunhye KIM ,  Yoonsuk LEE

IPC: H01L33/00 ,  H01L27/15

Abstract: An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

公开(公告)号：US20200312822A1

公开(公告)日：2020-10-01

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.

公开(公告)号：US20220069061A1

公开(公告)日：2022-03-03

申请号：US17523281

申请日：2021-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

公开(公告)号：US20200161405A1

公开(公告)日：2020-05-21

申请号：US16681290

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

公开(公告)号：US20190304816A1

公开(公告)日：2019-10-03

申请号：US16282581

申请日：2019-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Sangmoo PARK ,  Yoonsuk LEE

IPC: H01L21/67 ,  H01L21/687 ,  H01L33/62 ,  H01L25/075

Abstract: A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.

公开(公告)号：US20220375907A1

公开(公告)日：2022-11-24

申请号：US17880027

申请日：2022-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsik CHOI ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

公开(公告)号：US20200343297A1

公开(公告)日：2020-10-29

申请号：US16861728

申请日：2020-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Eunhye Kim ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/38

Abstract: A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.

公开(公告)号：US20200313035A1

公开(公告)日：2020-10-01

申请号：US16832884

申请日：2020-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Sangmoo PARK ,  Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Minsub OH ,  Dongyeob LEE

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

公开(公告)号：US20220139889A1

公开(公告)日：2022-05-05

申请号：US17574104

申请日：2022-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62 ,  H01L33/48 ,  H01L25/16 ,  H01L33/38 ,  H01L33/32 ,  H01L33/06

Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.

公开(公告)号：US20210202787A1

公开(公告)日：2021-07-01

申请号：US17133171

申请日：2020-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Wonsik CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.