公开(公告)号：US20180131087A1

公开(公告)日：2018-05-10

申请号：US15807094

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Young KIM ,  Sang-Seob KIM ,  Min PARK ,  Jung-Je BANG ,  Beom-Ju KIM ,  Jae-Heung YE ,  Yong-Won LEE ,  Jung-Sik PARK

IPC: H01Q1/52 ,  H01L23/552 ,  H05K1/18 ,  H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  G06F3/041 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q1/22

CPC classification number: H01Q1/526 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  H01L23/552 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/03 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/147 ,  H05K1/181 ,  H05K9/0024 ,  H05K9/0026 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungbok LEE ,  Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Jieun HWANG ,  Myungjun KIM ,  Min PARK ,  Sunga YANG

IPC: H01L23/552 ,  H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H05K7/20445 ,  H05K9/0032

Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.

公开(公告)号：US20230262940A1

公开(公告)日：2023-08-17

申请号：US18303284

申请日：2023-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewook HAM ,  Moonhyung KWON ,  Min PARK ,  Younggirl YUN ,  Taekkyun CHOI

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20481 ,  G06F1/203

Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

公开(公告)号：US20230156902A1

公开(公告)日：2023-05-18

申请号：US18091368

申请日：2022-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhwan LEE ,  Min PARK ,  Haejin LEE ,  Jaeheung YE ,  Yeonkyung CHUNG

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/10378

Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

公开(公告)号：US20210274637A1

公开(公告)日：2021-09-02

申请号：US17262973

申请日：2019-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghwa KIM ,  Min PARK ,  Dongil SON ,  Hyunwoo SIM ,  Jaedeok LIM ,  Chunghyo JUNG ,  Seungbum CHOI

IPC: H05K1/02

Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

公开(公告)号：US20240188218A1

公开(公告)日：2024-06-06

申请号：US18438124

申请日：2024-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonglak CHO ,  Joohan KIM ,  Juho KIM ,  Min PARK ,  Eunsoo PARK ,  Insun AN ,  Byungwoo LEE ,  Sangtae LEE ,  Haejin LEE

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/144 ,  H05K3/284 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10545

Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.