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公开(公告)号：USD782454S1
公开(公告)日：2017-03-28
申请号：US29532477
申请日：2015-07-07
Applicant: Samsung Electronics Co., Ltd.
Designer： Dongkyun Kim , Kukhwan Kim , Donghun Kim , Sungjin Yum , Jinie Ryu , Jiyoung Lee
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公开(公告)号：USD969791S1
公开(公告)日：2022-11-15
申请号：US29769468
申请日：2021-02-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yoonyoung Kim , Jiyoung Lee
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公开(公告)号：US11217241B2
公开(公告)日：2022-01-04
申请号：US16383968
申请日：2019-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hogon Kim , Jaeho Seo , Byungsoo Kim , Bumsu Shin , Jiyoung Lee
Abstract: An electronic device and a computer program product are provided herein. The electronic device includes: an audio module, a communication module, a microphone, a memory storing programming instructions, and a processor, which executes the program product, causing the electronic device to receive a voice command from a user via the microphone, request, upon receiving the voice command, situation information from a first external electronic device based on device information and the voice command, and after receiving the situation information, transmit the situation information to a second external electronic device via the communication module, and receiving content corresponding to the situation information from the second external electronic device and reproducing the received content.
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公开(公告)号：USD848993S1
公开(公告)日：2019-05-21
申请号：US29625120
申请日：2017-11-07
Applicant: Samsung Electronics Co., Ltd.
Designer： Jiyoung Lee , Kwangmoon Kim , Kukhwan Kim , Hae Sung Park , Dahyun Lee , Miri Lee , Jin-Hoo Lee , Youngsang Jang , Woohyeok Jeong
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公开(公告)号：USD843993S1
公开(公告)日：2019-03-26
申请号：US29623530
申请日：2017-10-25
Applicant: Samsung Electronics Co., Ltd.
Designer： Woohyeok Jeong , Jiyoung Lee , Kukhwan Kim , Kwang-Moon Kim , Young Sang Jang , Jin-Hoo Lee , Dahyun Lee
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Patent Agency Ranking
公开(公告)号：USD800720S1
公开(公告)日：2017-10-24
申请号：US29519827
申请日：2015-03-09
Applicant: Samsung Electronics Co., Ltd.
Designer： Dongkyun Kim , Kukhwan Kim , Donghun Kim , Sungjin Yum , Jinie Ryu , Jiyoung Lee
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公开(公告)号：USD792873S1
公开(公告)日：2017-07-25
申请号：US29533773
申请日：2015-07-22
Applicant: Samsung Electronics Co., Ltd.
Designer： Dongkyun Kim , Kukhwan Kim , Sungjin Yum , Jinie Ryu , Jiyoung Lee
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公开(公告)号：USD786254S1
公开(公告)日：2017-05-09
申请号：US29533570
申请日：2015-07-20
Applicant: Samsung Electronics Co., Ltd.
Designer： Sungjin Yum , Jinie Ryu , Kukhwan Kim , Dongkyun Kim , Donghun Kim , Jiyoung Lee
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公开(公告)号：USD782453S1
公开(公告)日：2017-03-28
申请号：US29532178
申请日：2015-07-02
Applicant: Samsung Electronics Co., Ltd.
Designer： Dongkyun Kim , Kukhwan Kim , Donghun Kim , Sungjin Yum , Jinie Ryu , Jiyoung Lee
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公开(公告)号：US20240234165A9
公开(公告)日：2024-07-11
申请号：US18381905
申请日：2023-10-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yuseon HEO , Junhyeong Park , Jieun Park , Jihye Shim , Jiyoung Lee
IPC: H01L21/48 , H01L23/31 , H01L23/498 , H01L25/18 , H10B80/00
CPC classification number: H01L21/4857 , H01L23/3128 , H01L23/49838 , H01L25/18 , H10B80/00 , H01L24/04
Abstract: Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, coating a high transmittance photoresist on the first wiring structure a plurality of number of times, forming a plurality of openings by exposing and developing the high transmittance photoresist, forming a plurality of conductive posts by filling the plurality of openings with a conductive material, removing the high transmittance photoresist, disposing a semiconductor chip on the first wiring structure, forming an encapsulant surrounding the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the light transmittance of the high transmittance photoresist at a portion where the first wiring structure and the high transmittance photoresist contact each other is greater than or equal to 3.2%.
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