公开(公告)号：US12237183B2

公开(公告)日：2025-02-25

申请号：US17210686

申请日：2021-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungsik Cho ,  Hogon Kim ,  Myoungryul Han ,  Hyunchul Kwun ,  Dongha Kim ,  Jangho Son

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/46 ,  C23C16/52 ,  H01J37/32

Abstract: A semiconductor processing system includes; a chamber, a substrate support disposed in the chamber, and a temperature controller including a thermal section disposed under the substrate support and a coupling section including at least one coupling section member. The thermal section includes a first plate and a second plate spaced apart under the substrate support, and each of the first plate and the second plate is coupled to a side portion of the substrate by at least one coupling section member.

公开(公告)号：US11217241B2

公开(公告)日：2022-01-04

申请号：US16383968

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hogon Kim ,  Jaeho Seo ,  Byungsoo Kim ,  Bumsu Shin ,  Jiyoung Lee

IPC: G10L15/22 ,  G06F3/16 ,  H04L29/08 ,  G10L15/06

Abstract: An electronic device and a computer program product are provided herein. The electronic device includes: an audio module, a communication module, a microphone, a memory storing programming instructions, and a processor, which executes the program product, causing the electronic device to receive a voice command from a user via the microphone, request, upon receiving the voice command, situation information from a first external electronic device based on device information and the voice command, and after receiving the situation information, transmit the situation information to a second external electronic device via the communication module, and receiving content corresponding to the situation information from the second external electronic device and reproducing the received content.