公开(公告)号：US12237183B2

公开(公告)日：2025-02-25

申请号：US17210686

申请日：2021-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungsik Cho ,  Hogon Kim ,  Myoungryul Han ,  Hyunchul Kwun ,  Dongha Kim ,  Jangho Son

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/46 ,  C23C16/52 ,  H01J37/32

Abstract: A semiconductor processing system includes; a chamber, a substrate support disposed in the chamber, and a temperature controller including a thermal section disposed under the substrate support and a coupling section including at least one coupling section member. The thermal section includes a first plate and a second plate spaced apart under the substrate support, and each of the first plate and the second plate is coupled to a side portion of the substrate by at least one coupling section member.