公开(公告)号：US12214491B2

公开(公告)日：2025-02-04

申请号：US17672081

申请日：2022-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongsup Byeon ,  Inwook Koo ,  Dongwon Kim ,  Minyoung Kim ,  Yi Jin ,  Jongkyu Kim ,  Jinho So ,  Byungjun An ,  Yinghu Xu ,  Beomsoo Hwang

IPC: B65G1/137 ,  B25J11/00 ,  B25J15/00 ,  B25J19/02 ,  F17C13/04 ,  G06K7/14 ,  B25J9/16

Abstract: A gas supply system includes a loading/unloading stage including a cradle loader where a cradle loaded with a gas container is loaded, a test buffer chamber is configured to test the gas container, and a loading/unloading robot configured to transfer the gas container between the cradle and the test buffer chamber. A gas supply stage includes a storage queue configured to temporarily store the gas container, a gas supply cabinet where the gas container is mounted, and a transfer robot configured to transfer the gas container between the test buffer chamber and the storage queue and between the storage queue and the gas supply cabinet.

公开(公告)号：US11846391B2

公开(公告)日：2023-12-19

申请号：US17721881

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Jongkyu Kim ,  Hyunsik Kim ,  Kyeongsup Byeon ,  Byungjun An ,  Byeongchan Jeong ,  Kimoon Lee ,  Hyungho Choi

IPC: F17C13/04 ,  F17C13/02

CPC classification number: F17C13/04 ,  F17C13/02 ,  F17C2205/037 ,  F17C2205/0329 ,  F17C2205/0382 ,  F17C2250/0478 ,  F17C2260/036

Abstract: A gas supply apparatus includes: a mounting portion installed on a cabinet; a gas supply portion installed on the mounting portion so as to be raisable and lowerable; and a gas container fixing portion fixing a gas container to the gas supply portion, wherein the gas supply portion includes a compressed gas association (CGA) fastening module that is installed on the mounting portion and is detachable from the gas container, and the CGA fastening module includes: a case; an end cap housing rotatably installed on the case; a CGA connector housing installed on the case so as to be disposed adjacent to the end cap housing; a gasket detection sensor installed on a sensor installation mount of the case and disposed under the CGA connector housing; and a power transmission portion spaced apart from the end cap housing and connected to the end cap housing and the CGA connector housing.

公开(公告)号：US11804393B2

公开(公告)日：2023-10-31

申请号：US17718574

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Jonghwi Seo ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67745 ,  H01L21/67167 ,  H01L21/68707

Abstract: A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

公开(公告)号：US20230080991A1

公开(公告)日：2023-03-16

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.