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    UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME
    12.
    发明申请
    UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME 有权
    单元功率模块和功率模块包装盒

    公开(公告)号：US20140117408A1

    公开(公告)日：2014-05-01

    申请号：US13782859

    申请日：2013-03-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

    Inventor： Tae Hyun Kim ,  Bum Seok Suh ,  Do Jae Yoo ,  Kwang Soo Kim

    IPC: H01L27/07

    CPC classification number: H01L24/34 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

    Abstract translation: 这里公开了一种单位功率模块，包括：第一半导体芯片，其具有一个表面，其上形成有与第1-1电极间隔开的第1-1电极和第1-2电极，另一个表面在 形成有第1-3电极的第二半导体芯片，形成有第2-1电极的一个表面的第二半导体芯片和形成有第2-2电极的另一表面，第一金属板接触 第一半导体芯片的第1-1电极和第二半导体芯片的第2-1电极，与第一半导体芯片的第1-2电极接触并与第一半导体芯片间隔开的第二金属板 与第一半导体芯片的第1-3电极和第二半导体芯片的第2-2电极接触的第三金属板和形成为围绕第一金属板，第二金属板， 和第三金属板。

    Unit power module and power module package comprising the same
    16.
    发明授权
    Unit power module and power module package comprising the same 有权
    单元电源模块和电源模块封装组成

    公开(公告)号：US09123683B2

    公开(公告)日：2015-09-01

    申请号：US13782859

    申请日：2013-03-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Bum Seok Suh ,  Do Jae Yoo ,  Kwang Soo Kim

    IPC: H01L23/00

    CPC classification number: H01L24/34 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

    Abstract translation: 这里公开了一种单位功率模块，包括：第一半导体芯片，其具有一个表面，其上形成有与第1-1电极间隔开的第1-1电极和第1-2电极，另一个表面在 形成有第1-3电极的第二半导体芯片，形成有第2-1电极的一个表面的第二半导体芯片和形成有第2-2电极的另一表面，第一金属板接触 第一半导体芯片的第1-1电极和第二半导体芯片的第2-1电极，与第一半导体芯片的第1-2电极接触并与第一半导体芯片间隔开的第二金属板 与第一半导体芯片的第1-3电极和第二半导体芯片的第2-2电极接触的第三金属板和形成为围绕第一金属板，第二金属板， 和第三金属板。

    SEMICONDUCTOR PACKAGE MODULE
    17.
    发明申请
    SEMICONDUCTOR PACKAGE MODULE 审中-公开
    半导体封装模块

    公开(公告)号：US20150181708A1

    公开(公告)日：2015-06-25

    申请号：US14268156

    申请日：2014-05-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong In Ryu ,  Eun Jung Jo ,  Do Jae Yoo

    IPC: H05K1/11

    CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/611

    Abstract: There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other.

    Abstract translation: 提供了一种半导体封装模块，包括：基板，其上形成有一个或多个连接端子; 安装在所述基板的第一表面上的第一电子部件; 安装在所述基板的第二表面上的第二电子部件; 以及形成在所述基板上并且包括将所述一个或多个连接端子和外部端子彼此连接的连接电极的第三电子部件。

    POWER MODULE PACKAGE
    18.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号：US20140167239A1

    公开(公告)日：2014-06-19

    申请号：US14106107

    申请日：2013-12-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Do Jae Yoo ,  Bum Seok Suh

    IPC: H01L23/495

    CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.

    Abstract translation: 本文公开了一种功率模块封装，包括：基板，包括金属层，形成在金属层上的第一绝缘层，形成在第一绝缘层上的第一电路图案，并且包括第一焊盘和与第一绝缘层间隔开的第二焊盘 衬垫，形成在所述第一绝缘层上以覆盖所述第一电路图案的第二绝缘层，以及形成在所述第二绝缘层上并包括形成在与所述第一焊盘相对应的位置的第三焊盘和间隔开的第四焊盘的第二焊盘图案 从第三垫; 安装在第二电路图案上的半导体芯片; 一端电连接到半导体芯片，另一端从外部突出，其中第一焊盘和第三焊盘以及第二焊盘和第四焊盘具有不同的极性。

    Manufacturing method of an electronic component module
    19.
    发明授权
    Manufacturing method of an electronic component module 有权

    公开(公告)号：US10667419B2

    公开(公告)日：2020-05-26

    申请号：US15825606

    申请日：2017-11-29

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Do Jae Yoo ,  Eun Jung Jo ,  Jae Hyun Lim

    IPC: H05K5/06 ,  H05K1/11 ,  H05K3/00

    Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

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