Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14798833Application Date: 2015-07-14
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Publication No.: US09508565B2Publication Date: 2016-11-29
- Inventor: Jae Hyun Lim , Do Jae Yoo , Eun Jung Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0090994 20140718
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/78 ; H01L21/768 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L23/14 ; H01L23/498 ; H01L21/48 ; H05K1/00
Abstract:
The semiconductor package according to an exemplary embodiment includes: a substrate having a plurality of circuit layers and connection pads which are provided between a plurality of insulating layers; a plated tail part of which one end is electrically connected to the connection pad; a dicing part provided in contact with the other end of the plated tail part; a molded part provided on the substrate; and molded part vias provided on the connection pads and penetrating through the molded part.
Public/Granted literature
- US20160020171A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-01-21
Information query
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