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公开(公告)号：US20180257982A1
公开(公告)日：2018-09-13
申请号：US15863110
申请日：2018-01-05
Applicant: Samsung Display Co., Ltd.
Inventor： Hoi Kwan Lee , Cheol Min Park , Eun Kyung Yeon , Jeong Seok Lee , Seung Ho Kim
CPC classification number: C03C23/008 , C03C15/02 , C03C21/002
Abstract: According to an exemplary embodiment of the present disclosure, a method of manufacturing a display window includes preparing a mother substrate, performing a salt treatment on the mother substrate to form a silicon-rich layer in a surface of the mother substrate to a first depth from the surface of the mother substrate, and removing the silicon-rich layer, wherein the first depth is greater than a depth of any cracks in the surface of the mother substrate, and a ratio of silicon content in the silicon-rich layer to a silicon content in the mother substrate is 1.2 to 1.4.
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公开(公告)号：US20180136095A1
公开(公告)日：2018-05-17
申请号：US15816943
申请日：2017-11-17
Applicant: Samsung Display Co., Ltd.
Inventor： Cheol Min Park , Jeong Woo Park , Seung Kim , Seung Ho Kim , Hoi Kwan Lee , Woo Jin Cho , Hee Kyun Shin , Hyun Joon Oh
IPC: G01N1/30 , G01N21/958
Abstract: A method of detecting defects of a glass substrate includes cutting a glass mother substrate into a plurality of glass substrates, penetrating ions into an incision surface of the glass substrate to visualize defects of the incision surface, and photographing the defects of the incision surface to determine a bending strength of the glass substrate based on a size of the defects.
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公开(公告)号：US20180132371A1
公开(公告)日：2018-05-10
申请号：US15804274
申请日：2017-11-06
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hoon YEUM , Seung KIM , Hoi Kwan LEE , Seung Ho Kim
CPC classification number: H05K5/03 , B32B7/12 , B32B17/00 , B32B2307/412 , B32B2307/536 , B32B2307/546 , B32B2307/558 , B32B2457/206 , G02F1/133305 , G02F2001/133368 , H01L27/3244 , H01L51/0097 , H01L2251/5338 , H01L2251/558 , H05K5/0017
Abstract: A window substrate for protecting an electronic display device includes a first glass substrate having a first thickness, a second glass substrate having a second thickness, and an interlayer disposed between the first glass substrate and the second glass substrate, the interlayer having a third thickness, wherein the sum of the first thickness, the second thickness, and the third thicknesses is equal to or less than about 190 μm. A display device including a display panel to display an image and a window substrate also is disclosed.
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公开(公告)号：USD1052565S1
公开(公告)日：2024-11-26
申请号：US29783138
申请日：2021-05-11
Applicant: Samsung Display Co., Ltd.
Designer： Seung Kim , Byung Hoon Kang , Kyung Rok Ko , Seung Ho Kim , Young-Seok Seo , Gyu In Shim , Jeong Ho Hwang , Young Su Kim , Jae Suk Yoo , Yong Won Yun , Jeong-Seop Choi
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15.发明授权公开(公告)号：US12119859B2
公开(公告)日：2024-10-15
申请号：US17481021
申请日：2021-09-21
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Byung Hoon Kang , Byeong-Beom Kim , Seung Ho Kim , Cheol Min Park , Chang Moo Lee , Hoi Kwan Lee
IPC: H04B1/3888 , B32B17/10 , G06F1/16 , C03C23/00
CPC classification number: H04B1/3888 , B32B17/10174 , G06F1/1652 , C03C23/009
Abstract: A cover window, a manufacturing method of a cover window, and a display device including a cover window are provided. A cover window includes a folding portion and a non-folding portion, and the folding portion includes an inside surface that is compressed when folded and an outside surface that is stretched when folded, the folding portion includes a first layer adjacent to the outside surface, a second layer adjacent to the inside surface, and a third layer between the first layer and the second layer, the folding portion and the non-folding portion include at least one metal ion, a concentration of the metal ion included in the second layer is higher than a concentration of the metal ion included in the first layer, and the first layer includes a plurality of depletion regions.
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Patent Agency Ranking
公开(公告)号：US12059771B2
公开(公告)日：2024-08-13
申请号：US17348745
申请日：2021-06-15
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Gyu In Shim , Byung Hoon Kang , Seung Kim , Seung Ho Kim
Abstract: A glass polishing apparatus includes a jig that holds a glass structure. The glass polishing apparatus includes a first flat portion, a second flat portion opposite to the first flat portion, and a curved portion connecting the first flat portion to the second flat portion. The jig and includes a first holding surface holding the first flat portion, a second holding surface disposed opposite to the first holding surface and holding the second flat portion, and a third holding surface connecting the first holding surface to the second holding surface and holding the curved portion. At least a portion of a roller unit having a cylindrical shape is inserted between the first flat portion and the second flat portion.
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公开(公告)号：US11737226B2
公开(公告)日：2023-08-22
申请号：US17210440
申请日：2021-03-23
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hoon Yeum , Seung Kim , Hoi Kwan Lee , Seung Ho Kim
IPC: G06F1/16 , H05K5/03 , G02F1/1333 , B32B7/12 , B32B17/00 , H05K5/00 , H10K59/12 , H10K77/10 , H10K102/00
CPC classification number: H05K5/03 , B32B7/12 , B32B17/00 , G02F1/133305 , G06F1/1652 , H05K5/0017 , B32B2307/412 , B32B2307/536 , B32B2307/546 , B32B2307/558 , B32B2457/206 , G02F1/133368 , H10K59/12 , H10K77/111 , H10K2102/311 , H10K2102/351
Abstract: A window substrate for protecting an electronic display device, the window substrate includes: a first substrate; a second substrate; and an interlayer having opposed sides disposed between the first substrate and the second substrate, with one side of the interlayer being in contact with the first substrate, and the other side of the interlayer being in contact with the second substrate, wherein the first substrate has a first thickness, the second substrate has a second thickness, and the interlayer has a third thickness, and wherein the sum of the first thickness, the second thickness, and the third thickness is about 190 μm or less.
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公开(公告)号：US20220193829A1
公开(公告)日：2022-06-23
申请号：US17479457
申请日：2021-09-20
Applicant: Samsung Display Co., Ltd.
Inventor： Cheol Min Park , Byung Hoon Kang , Seung Kim , Seung Ho Kim , Woo Suk Seo , Hoi Kwan Lee
IPC: B23K26/40 , B23K26/364
Abstract: A manufacturing method of a display device includes: forming a laminate by laminating resins on first and second side surfaces of a glass; removing the resins along a laser irradiation line by irradiating a laser on the laminate; separating the laminate into a plurality of laminates by performing primary etching using an etching liquid composition; vertically stacking the plurality of laminates; and performing secondary chemical etching on a structure formed by stacking the plurality of laminates.
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公开(公告)号：US10986744B2
公开(公告)日：2021-04-20
申请号：US15804274
申请日：2017-11-06
Applicant: Samsung Display Co., Ltd.
Inventor： Jong Hoon Yeum , Seung Kim , Hoi Kwan Lee , Seung Ho Kim
Abstract: A window substrate for protecting an electronic display device includes a first glass substrate having a first thickness, a second glass substrate having a second thickness, and an interlayer disposed between the first glass substrate and the second glass substrate, the interlayer having a third thickness, wherein the sum of the first thickness, the second thickness, and the third thicknesses is equal to or less than about 190 μm. A display device including a display panel to display an image and a window substrate also is disclosed.
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公开(公告)号：US10899662B2
公开(公告)日：2021-01-26
申请号：US15863110
申请日：2018-01-05
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Hoi Kwan Lee , Cheol Min Park , Eun Kyung Yeon , Jeong Seok Lee , Seung Ho Kim
Abstract: According to an exemplary embodiment of the present disclosure, a method of manufacturing a display window includes preparing a mother substrate, performing a salt treatment on the mother substrate to form a silicon-rich layer in a surface of the mother substrate to a first depth from the surface of the mother substrate, and removing the silicon-rich layer, wherein the first depth is greater than a depth of any cracks in the surface of the mother substrate, and a ratio of silicon content in the silicon-rich layer to a silicon content in the mother substrate is 1.2 to 1.4.
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