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    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE PROVIDING HEAT TRANSFER PATH
    13.
    发明申请
    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE PROVIDING HEAT TRANSFER PATH 有权

    公开(公告)号：US20250089215A1

    公开(公告)日：2025-03-13

    申请号：US18750244

    申请日：2024-06-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungsoo JANG ,  Yongwoon KIM ,  Sangwon LEE ,  Eunsoo PARK ,  Jinwan AN

    IPC: H05K7/20 ,  H05K9/00

    Abstract: An electronic device is disclosed. The electronic device includes a first shield can configured to accommodate an electronic component, a second shield can spaced apart from the first shield can, a heat dissipation structure comprising a heat dissipation material including an end connected to the first shield can and another end connected to the second shield can, and a thermally conductive material disposed in the heat dissipation structure, extending from at least a portion of an inner space of the first shield can to at least a portion of an inner space of the second shield can through the heat dissipation structure.

    IMAGE PROCESSING APPARATUS AND OPERATING METHOD THEREOF
    15.
    发明申请
    IMAGE PROCESSING APPARATUS AND OPERATING METHOD THEREOF 有权

    公开(公告)号：US20230031143A1

    公开(公告)日：2023-02-02

    申请号：US17723055

    申请日：2022-04-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangwook BAEK ,  Sangwon LEE ,  Taekeun KANG ,  Dongkyu KIM ,  Gihyeon BAE ,  Jungmin LEE ,  Youngo PARK ,  Kwangpyo CHOI

    IPC: G06T3/40 ,  G06T7/00

    Abstract: An image processing apparatus for performing image quality processing on an image includes: a memory configured to store one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: obtain a first image by downscaling an input image by using a downscale network; extract first feature information corresponding to the first image by using a feature extraction network; obtain a second image by performing image quality processing on the first image based on the first feature information, by using an image quality processing network; and obtain an output image by upscaling the second image, extracting second feature information corresponding to the input image, and performing image quality processing on the upscaled second image based on the second feature information, by using an upscale network.

    METHOD OF MARKING SEMICONDUCTOR PACKAGE
    18.
    发明申请
    METHOD OF MARKING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250096148A1

    公开(公告)日：2025-03-20

    申请号：US18762757

    申请日：2024-07-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kanggyune LEE ,  Sangwon LEE ,  Hyeon HWANG

    IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31

    Abstract: A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of the dry film by radiating laser light to the carrier substrate, forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film, and removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied, wherein the ink marking pattern includes information about storage capacity or information for identifying a producer of a product.

    COOKING APPARATUS
    19.
    发明申请
    COOKING APPARATUS 有权

    公开(公告)号：US20240377068A1

    公开(公告)日：2024-11-14

    申请号：US18596960

    申请日：2024-03-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sunwoo HAN ,  Hyeongjin JANG ,  Soonmin LIM ,  Eunji JO ,  Byounghoon MOON ,  Sangwon LEE

    IPC: F24C3/08 ,  F23D14/04

    Abstract: A cooking apparatus can include a main body including at least one opening, the main body forming a cooking chamber, a burner in the main body to heat the cooking chamber, and a silencer mounted to the main body and covering the at least one opening so that: air from an outside of the main body is passable through the silencer and the at least one opening to be supplied to the burner, and noise generated by the burner, and discharged through the silencer and the at least one opening to the outside of the main body, is reduced by the silencer.

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