公开(公告)号：US11450652B2

公开(公告)日：2022-09-20

申请号：US16882914

申请日：2020-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Byungchul Kim ,  Sangmoo Park ,  Minsub Oh

IPC: H01L25/16 ,  H01L33/50 ,  H01L25/075

Abstract: A micro LED transferring method is provided. The transferring method includes selectively applying a color conversion material to a mono-color substrate, the mono-color substrate including first micro LEDs in a first color; obtaining a multi-color substrate based on a result of the applying, the multi-color substrate including the first micro LEDs in the first color and second micro LEDs in a second color different from the first color; and irradiating a laser beam toward the multi-color substrate to transfer the first micro LEDs and the second micro LEDs to a target substrate.

公开(公告)号：US11387384B2

公开(公告)日：2022-07-12

申请号：US16850645

申请日：2020-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo Park ,  Minsub Oh ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L33/00 ,  H01L33/24 ,  H01L25/075

Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.

公开(公告)号：US11251222B2

公开(公告)日：2022-02-15

申请号：US16426846

申请日：2019-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L27/15 ,  H01L33/00 ,  H01L21/66 ,  G01N21/95 ,  G01N21/17

Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.

公开(公告)号：US11063174B2

公开(公告)日：2021-07-13

申请号：US16653449

申请日：2019-10-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Masaru Wada ,  Jamyeong Koo ,  Eunhye Kim ,  Sangmoo Park ,  Seona Yang ,  Minsub Oh ,  Yoonsuk Lee ,  Youngkyong Jo

IPC: H01L33/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/46

Abstract: A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.

公开(公告)号：US20210057401A1

公开(公告)日：2021-02-25

申请号：US16998118

申请日：2020-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyeob Lee ,  Doyoung Kwag ,  Sangmoo Park ,  Seona Yang ,  Yoonsuk Lee

IPC: H01L25/16

Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.

公开(公告)号：US11916047B2

公开(公告)日：2024-02-27

申请号：US17574104

申请日：2022-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  H01L23/00 ,  H01L33/48 ,  H01L33/38 ,  H01L33/32 ,  H01L33/06

CPC classification number: H01L25/0753 ,  H01L24/06 ,  H01L25/167 ,  H01L33/48 ,  H01L33/62 ,  H01L33/06 ,  H01L33/32 ,  H01L33/38

Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.

公开(公告)号：US11849613B2

公开(公告)日：2023-12-19

申请号：US17523281

申请日：2021-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye Kim ,  Doyoung Kwag ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H10K59/131 ,  H10K59/121

CPC classification number: H10K59/131 ,  H10K59/1213

Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

公开(公告)号：US11791322B2

公开(公告)日：2023-10-17

申请号：US17677182

申请日：2022-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/13 ,  H01L33/00

CPC classification number: H01L25/13 ,  H01L33/005

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US11437541B2

公开(公告)日：2022-09-06

申请号：US16870242

申请日：2020-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Minsub Oh

IPC: H01L33/00 ,  G01R31/26 ,  H01L25/075

Abstract: A method of manufacturing a micro light emitting diode (LED) display and a transfer apparatus are provided. The method of manufacturing a micro LED display includes: identifying a repairing micro LED, from among a plurality of second micro LEDs, on a second substrate based on a first position of a defective micro LED, from among a plurality of first micro LEDs, on a first substrate; removing the defective micro LED from the first substrate; matching the first position on the first substrate from which the defective micro LED has been removed to a second position of the repairing micro LED on the second substrate; and transferring the repairing micro LED from the second position on the second substrate to the first position on the first substrate from which the defective micro LED has been removed, by using a laser transfer method.

公开(公告)号：US11437356B2

公开(公告)日：2022-09-06

申请号：US16998118

申请日：2020-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyeob Lee ,  Doyoung Kwag ,  Sangmoo Park ,  Seona Yang ,  Yoonsuk Lee

IPC: H01L31/036 ,  H01L29/15 ,  H01L29/04 ,  H01L27/14 ,  H01L25/16

Abstract: A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.