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公开(公告)号:US10410685B2
公开(公告)日:2019-09-10
申请号:US16293372
申请日:2019-03-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Reum Oh , Je-Min Ryu , Pavan Kumar Kasibhatla
IPC: G11C5/02 , G06F12/0893 , G11C29/12 , G11C29/48 , G11C7/10 , G06F12/084 , H01L25/18
Abstract: A memory device includes a memory cell array having a plurality of memory cell groups with a corresponding plurality of independent channels, and the device and an operating method thereof perform an internal data processing operation for the memory cell groups. The memory device includes an internal command generator configured to generate one or more internal commands in order to perform an internal data processing operation in response to a reception of a command, and an internal common bus for a common internal processing channel which is disposed to be shared by the plurality of memory cell groups and configured to form a transmission path of data between the plurality of memory cell groups when the internal data processing operation is performed.
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公开(公告)号:US10331354B2
公开(公告)日:2019-06-25
申请号:US15617450
申请日:2017-06-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hak-Soo Yu , Je-Min Ryu , Reum Oh , Pavan Kumar Kasibhatla , Seok-In Hong
Abstract: A stacked memory includes a logic semiconductor die, a plurality of memory semiconductor dies stacked with the logic semiconductor die, a plurality of through-silicon vias (TSVs) electrically connecting the logic semiconductor die and the memory semiconductor dies, a global processor disposed in the logic semiconductor die and configured to perform a global sub process corresponding to a portion of a data process, a plurality of local processors respectively disposed in the memory semiconductor dies and configured to perform local sub processes corresponding to other portions of the data process and a plurality of memory integrated circuits respectively disposed in the memory semiconductor dies and configured to store data associated with the data process.
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