公开(公告)号：US20180081102A1

公开(公告)日：2018-03-22

申请号：US15826015

申请日：2017-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Sang ah GAM ,  Hye Young KONG ,  Hyung Jun KIM ,  Hyun-Seok CHOI ,  Myung Sup JUNG

IPC: G02B5/30 ,  G02F1/13363 ,  B32B37/00 ,  G02F1/1335

Abstract: An optical film includes a polarization film including a polymer resin and a dichroic dye, and a phase delay layer disposed on the polarization film and including a liquid crystal.

公开(公告)号：US20150131032A1

公开(公告)日：2015-05-14

申请号：US14248052

申请日：2014-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Jun KIM ,  Sang ah GAM ,  Myung Sup JUNG ,  Hyun-Seok CHOI

IPC: G02F1/13363 ,  G02B5/30 ,  G02F1/1335

CPC classification number: G02F1/13363 ,  B32B2457/202 ,  B32B2457/206 ,  C09K19/02 ,  G02B5/3016 ,  G02B5/3083 ,  G02F1/133634 ,  G02F2001/133633 ,  G02F2001/133637 ,  G02F2202/40 ,  Y10T428/1036 ,  Y10T428/105

Abstract: A compensation film includes a first retardation layer including a polymer having negative birefringence, and a second retardation layer including a liquid crystal having positive birefringence, where the first retardation layer has an in-plane retardation (Re1) of 320 nm to 1050 nm for incident light having wavelength of 550 nm, the second retardation layer has an in-plane retardation (Re2) of 180 nm to 910 nm for the incident light, an entire in-plane retardation (Re0) of the first and second retardation layers for the incident light is a difference between the in-plane retardations of the first and second retardation layers, an angle between slow axes of the first and second retardation layers is 85 to 95 degrees, and the entire in-plane retardation (Re0) of the first and second retardation layers for the wavelength of 450 nm, 550 nm and 650 nm satisfies Re0 (450 nm)

Abstract translation: 补偿膜包括具有负双折射聚合物的第一延迟层和包括具有正双折射的液晶的第二延迟层，其中第一延迟层具有320nm至1050nm的面内延迟（Re1），用于入射 具有波长为550nm的光，第二延迟层对入射光具有180nm至910nm的面内相位差（Re2），用于入射的第一和第二延迟层的面内延迟（Re0）整体 光是第一和第二延迟层的平面内延迟之间的差异，第一和第二延迟层的慢轴之间的角度为85度至95度，并且第一和第二相位差层的第一和第二延迟层的平面内延迟（Re0） 对于450nm，550nm和650nm的波长的第二延迟层满足Re0（450nm）

公开(公告)号：US20140334108A1

公开(公告)日：2014-11-13

申请号：US14340242

申请日：2014-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-San JUNG ,  Joo-Han LEE ,  Jung-Chan CHO ,  Hyun-Seok CHOI

IPC: H05K3/10 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/10 ,  H05K1/0353 ,  H05K1/112 ,  H05K3/3452 ,  H05K2201/09581 ,  H05K2201/09909 ,  Y10T29/49155

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.

Abstract translation: 提供了包括自组装有机分子层的半导体封装模块和制造半导体封装模块的方法。 半导体封装模块可以包括具有多个金属线图案和形成在其上的多个安装焊盘的模块印刷电路板（PCB）。 半导体封装还可以包括在从多个金属线图案中选择的至少一种金属线图案上自组装的绝缘薄膜。 为了制造半导体封装模块，绝缘薄膜形成为在模块PCB上形成多个金属线图案，其中形成多个通孔，然后将有机化合物自组装在 从所述多个金属线图案中选择的至少一个金属线图案的表面。