Magnetic stripe data transmission device and method

    公开(公告)号:US10789521B2

    公开(公告)日:2020-09-29

    申请号:US16092705

    申请日:2017-05-10

    Abstract: The present invention relates to a device for transmitting data and, particularly, to a device for transmitting data by using a magnetic stripe method. According to one embodiment of the present invention, the magnetic stripe data transmission device comprises: a coil to which a current is supplied in a first direction and a second direction, which is opposite to the first direction; a core for inducing a magnetic field when the current is supplied to the coil; a power source for supplying the current to the coil; driving units for intermittently supplying, to the coil, in the first direction or the second direction, a burst pulse or pseudo-burst pulse current supplied from the power source; and a control unit for outputting, to the driving units, a control signal in order to perform control such that the current is supplied to the coil alternately in the first direction and the second direction, wherein the core can be made of a material having an aspect ratio value of at least 0.5, having a coercivity value of 1000-10,000 [A/m], and having pseudo-hard magnetic density of which the saturated magnetic flux density value is at least 1 [T].

    Low-frequency heating apparatus and method using magnetic field

    公开(公告)号:US10524316B2

    公开(公告)日:2019-12-31

    申请号:US15331112

    申请日:2016-10-21

    Abstract: A low-frequency heating apparatus is provided. The low-frequency heating apparatus includes a signal generator configured to generate an operation frequency for inducing a current through a coil unit surrounding an internal area of a housing of the heating apparatus, a power amplifier configured to amplify power of the operation frequency to a predetermined level and transmit the amplified operation frequency to the coil unit, the coil unit configured to be energized to heat an object provided inside the housing through a magnetic field generated by the current, and at least one processor configured to monitor an impedance value of the coil unit resonating at the operation frequency and control a resonant operation of the coil unit based on the impedance value of the coil unit and an impedance value of the power amplifier.

    Separable antenna and electronic device comprising same

    公开(公告)号:US12300898B2

    公开(公告)日:2025-05-13

    申请号:US18192910

    申请日:2023-03-30

    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.

    Antenna module and device including same

    公开(公告)号:US12218407B2

    公开(公告)日:2025-02-04

    申请号:US17946688

    申请日:2022-09-16

    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

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