Solid-state imaging device
    11.
    发明授权

    公开(公告)号:US09653510B2

    公开(公告)日:2017-05-16

    申请号:US14554450

    申请日:2014-11-26

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Solid-state imaging apparatus and method of driving the same

    公开(公告)号:US12177585B2

    公开(公告)日:2024-12-24

    申请号:US18212037

    申请日:2023-06-20

    Abstract: An imaging device including a photoelectric converter that generates signal charge; a charge storage region that stores the signal charge; a first transistor that has a gate coupled to the charge storage region and reads out the signal charge; a second transistor that has a source and a drain, an output of the first transistor being fed back to one of the source and the drain and being supplied to the charge storage region from the other of the source and the drain; and voltage supply circuitry that supplies voltages varying with time. In a reset operation for discharging the signal charge stored in the charge storage region, the voltage supply circuitry supplies the voltages to a gate of the second transistor.

    Imaging device
    13.
    发明授权

    公开(公告)号:US12120448B2

    公开(公告)日:2024-10-15

    申请号:US17683465

    申请日:2022-03-01

    CPC classification number: H04N25/778 H04N25/60 H04N25/772

    Abstract: An imaging device includes: a solid-state imaging element having a plurality of pixel cells arranged in a matrix; and a signal processing part configured to process a detection signal outputted from each of the pixel cells. The pixel cells each include an avalanche photodiode and output a voltage corresponding to a count number of photons received by the avalanche photodiode as the detection signal. The signal processing part includes a variation calculation part configured to calculate a variation between the pixel cells in the detection signal outputted from each of the pixel cells, and a correction calculation part configured to correct the detection signal outputted from each of the pixel cells, on the basis of the variation calculated by the variation calculation part.

    Distance measurement device and image generation method

    公开(公告)号:US11988750B2

    公开(公告)日:2024-05-21

    申请号:US17482365

    申请日:2021-09-22

    CPC classification number: G01S17/894 G01S17/10 G06T7/11

    Abstract: A distance measurement device includes: an image capturer that captures N segmental images corresponding to N segmental distances into which a distance measurement range is divided; and a range image generator that generates a range image from the N segmental images. The range image generator determines: among segmental pixels included in the N segmental images, a segmental pixel having a maximum signal value from N segmental pixels at the same pixel position among pixel positions; a value indicating a segmental distance of the segmental pixel having the maximum signal value to be a distance value of the pixel position of the range image, when the maximum signal value is greater than or equal to a threshold; and a value indicating a value outside the distance measurement range to be the distance value of the pixel position of the range image, when the maximum signal value is less than the threshold.

    Solid-state imaging apparatus and method of driving the same

    公开(公告)号:US10897590B2

    公开(公告)日:2021-01-19

    申请号:US16178396

    申请日:2018-11-01

    Abstract: An imaging device includes a photoelectric converter generating signal charge; a charge storage region storing the signal charge; a first transistor having a gate coupled to the charge storage region; a second transistor having a source and a drain; and voltage supply circuitry supplying voltages varying with time. An output of the first transistor is fed back to the second transistor and is supplied to the charge storage region. A reset operation for discharging the signal charge in the charge storage region includes a first reset operation and a second reset operation. In the first reset operation, the second transistor changes from an OFF state to an ON state and then changes to an OFF state. In the second reset operation, the voltage supply circuitry supplies the voltages to a gate of the second transistor so that the second transistor gradually changes from an OFF state to an ON state.

    Solid-state imaging device
    16.
    发明授权

    公开(公告)号:US10103181B2

    公开(公告)日:2018-10-16

    申请号:US15487941

    申请日:2017-04-14

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Solid-state imaging device
    17.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号:US09319609B2

    公开(公告)日:2016-04-19

    申请号:US14578560

    申请日:2014-12-22

    CPC classification number: H04N5/3745 H01L27/14643 H04N5/363 H04N5/378

    Abstract: A pixel unit included in a sensor chip includes: a first pixel connected to a first feedback amplifier which is connected to a first column signal line as an input line and a first reset drain line as an output line; and a second pixel connected to a second feedback amplifier which is connected to a second column signal line as an input line and a second reset drain line as an output line. A drain of a reset transistor of the first pixel is connected to the first reset drain line, a drain of a reset transistor of the second pixel is connected to the second reset drain line, a source of an amplifying transistor of the first pixel is connected to the first column signal line, and a source of an amplifying transistor of the second pixel is connected to the second column signal line.

    Abstract translation: 包括在传感器芯片中的像素单元包括:连接到第一反馈放大器的第一像素,其连接到作为输入线的第一列信号线和作为输出线的第一复位漏极线; 以及连接到第二反馈放大器的第二像素,其连接到作为输入线的第二列信号线和作为输出线的第二复位漏极线。 第一像素的复位晶体管的漏极连接到第一复位漏极线,第二像素的复位晶体管的漏极连接到第二复位漏极线,第一像素的放大晶体管的源极连接 到第一列信号线,并且第二像素的放大晶体管的源极连接到第二列信号线。

    Solid-state imaging device
    20.
    发明授权

    公开(公告)号:US11605656B2

    公开(公告)日:2023-03-14

    申请号:US17025620

    申请日:2020-09-18

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

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