Solid-state imaging device
    1.
    发明授权

    公开(公告)号:US09653510B2

    公开(公告)日:2017-05-16

    申请号:US14554450

    申请日:2014-11-26

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Solid-state imaging device
    2.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号:US09386248B2

    公开(公告)日:2016-07-05

    申请号:US14554037

    申请日:2014-11-25

    Abstract: A pixel includes: a photoelectric conversion unit that photoelectrically converts incident light and has an upper electrode, a lower electrode, and a photoelectric conversion film interposed between the upper electrode and the lower electrode; an amplifying transistor that outputs a signal according to an amount of a signal charge generated in the photoelectric conversion unit; a charge transfer line that connects the lower electrode and the amplifying transistor; and an output line that outputs the signal from the amplifying transistor, wherein at least a part of the output line is disposed to overlap the lower electrode without another line interposed therebetween.

    Abstract translation: 像素包括:光电转换单元,其对入射光进行光电转换,并具有插入在上电极和下电极之间的上电极,下电极和光电转换膜; 放大晶体管,其根据在所述光电转换单元中产生的信号电荷的量输出信号; 连接下电极和放大晶体管的电荷传输线; 以及输出线,其输出来自所述放大晶体管的信号,其中所述输出线的至少一部分设置成与所述下电极重叠,而不插入另一条线。

    SOLID-STATE IMAGING DEVICE
    3.
    发明申请

    公开(公告)号:US20210005650A1

    公开(公告)日:2021-01-07

    申请号:US17025620

    申请日:2020-09-18

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Solid-state imaging device
    4.
    发明授权

    公开(公告)号:US10600826B2

    公开(公告)日:2020-03-24

    申请号:US15806139

    申请日:2017-11-07

    Inventor: Hirohisa Ohtsuki

    Abstract: A pixel array in a solid-state imaging device includes first and second signal lines provided for each column. A pixel belongs to a first or second group on a row-by-row basis and includes a photoelectric conversion film, a FD line for accumulating signal charge, and an amplifier transistor for providing a voltage according to the signal charge. The pixel in the first group further includes a selection transistor for proving output voltage of the amplifier transistor to the first signal line, and the pixel in the second group further includes a selection transistor for proving output voltage of the amplifier transistor to the second signal line. The first signal line is disposed between the FD line in the first group and the second signal line, and the second signal line is disposed between the FD line in the second group and the first signal line.

    Solid-state imaging device
    5.
    发明授权

    公开(公告)号:US10103181B2

    公开(公告)日:2018-10-16

    申请号:US15487941

    申请日:2017-04-14

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Wiring structure for solid-state imaging device

    公开(公告)号:US09825072B2

    公开(公告)日:2017-11-21

    申请号:US14553586

    申请日:2014-11-25

    Inventor: Hirohisa Ohtsuki

    CPC classification number: H01L27/14603 H01L27/14643 H04N5/3745

    Abstract: A pixel array in a solid-state imaging device includes first and second signal lines provided for each column. A pixel belongs to a first or second group on a row-by-row basis and includes a photoelectric conversion film, a FD line for accumulating signal charge, and an amplifier transistor for providing a voltage according to the signal charge. The pixel in the first group further includes a selection transistor for proving output voltage of the amplifier transistor to the first signal line, and the pixel in the second group further includes a selection transistor for proving output voltage of the amplifier transistor to the second signal line. The first signal line is disposed between the FD line in the first group and the second signal line, and the second signal line is disposed between the FD line in the second group and the first signal line.

    Solid-state imaging device
    7.
    发明授权

    公开(公告)号:US10818707B2

    公开(公告)日:2020-10-27

    申请号:US16130664

    申请日:2018-09-13

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    Solid-state imaging device
    9.
    发明授权

    公开(公告)号:US12080728B2

    公开(公告)日:2024-09-03

    申请号:US17969411

    申请日:2022-10-19

    Inventor: Hirohisa Ohtsuki

    CPC classification number: H01L27/14603 H01L27/14643 H04N25/77

    Abstract: An imaging device incudes a pixel array including pixels arranged in columns and rows, one of the columns including a first pixel in a first row and a second pixel in a second row; a first signal line, to which the first pixel is coupled, and a second signal line, to which the second pixel is coupled, extending in a column direction of the pixels; and a first shield line, to which the first pixel is coupled, extending in the column direction. The first signal line, the first shield line, and the second signal line are arranged along a row direction of the pixels in that order.

    Solid-state imaging device
    10.
    发明授权

    公开(公告)号:US11605656B2

    公开(公告)日:2023-03-14

    申请号:US17025620

    申请日:2020-09-18

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

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