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11.发明申请公开(公告)号：US20160377820A1
公开(公告)日：2016-12-29
申请号：US15260927
申请日：2016-09-09
Applicant: OLYMPUS CORPORATION
Inventor： Hideharu MIYAHARA , Hiroyuki MOTOHARA
CPC classification number: G02B6/424 , G02B6/00 , G02B6/32 , G02B6/3608 , G02B6/4202 , G02B6/4238 , H01S5/02284
Abstract: An optical transmission module includes an optical element including a light-emitting section configured to output light of an optical signal, a hollow cylindrical body joined perpendicularly to a light output surface of the optical element, a wiring board, on a first principal surface of which the optical element is mounted and through a hole of which the hollow cylindrical body is inserted, and an optical fiber configured to transmit the optical signal, a distal end portion of which is inserted into the hollow cylindrical body.
Abstract translation: 光传输模块包括：光学元件，其包括被配置为输出光信号的光的发光部分，垂直于所述光学元件的光输出表面连接的中空圆柱体，在其第一主表面上的布线板 安装光学元件并穿过其中插入中空圆柱体的孔，以及配置为将光学信号传输的光纤，其前端部插入中空圆柱体中。
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公开(公告)号：US20150318924A1
公开(公告)日：2015-11-05
申请号：US14796424
申请日：2015-07-10
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki MOTOHARA
CPC classification number: H04B10/501 , A61B1/00013 , G02B6/4202 , G02B6/4259 , G02B6/4279 , G02B6/4281 , H01L2224/16 , H01S5/02272 , H01S5/02284 , H01S5/183 , H04B10/2504
Abstract: An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.
Abstract translation: 光传输模块包括：将电信号转换为光信号的光电转换元件; 驱动光电转换元件的光电转换元件驱动IC; 发送光信号的光纤; 保持光纤的引导保持构件; 向光电转换元件和光电转换元件驱动IC中的至少一个供电的电缆; 以及其上安装有光电转换元件和光电转换元件驱动IC的基板。 基板具有彼此垂直的第一和第二平面。 光电转换元件安装在第一平面上。 光纤连接到第一平面的背面。 光纤的光轴垂直于第一平面。 电缆与光纤的光轴平行地连接到第二平面。
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公开(公告)号：US20150086162A1
公开(公告)日：2015-03-26
申请号：US14498067
申请日：2014-09-26
Applicant: OLYMPUS CORPORATION
Inventor： Hideharu MIYAHARA , Hiroyuki MOTOHARA
CPC classification number: G02B6/4204 , A61B1/00013 , G02B6/32 , G02B6/4274 , G02B6/428 , G02B6/4296 , G02B23/2423 , G02B23/2446 , G02B23/2469 , G02B23/2484
Abstract: An optical transmission module includes: an optical device having a light emitting section that outputs light of an optical signal; an optical fiber that transmits the optical signal; a holding member in which a distal end portion of the optical fiber is inserted into a through hole having an inner diameter equivalent to an outer diameter of the optical fiber, and that is disposed on the optical device; and a lens section that is disposed in an opening on the optical device side of the through hole of the holding member, and that concentrates the light.
Abstract translation: 光传输模块包括：具有输出光信号光的发光部分的光学装置; 发送光信号的光纤; 保持构件，其中所述光纤的前端部插入到具有与所述光纤的外径相当的内径的通孔中，并且设置在所述光学装置上; 以及透镜部，其设置在保持部件的通孔的光学装置侧的开口部，并且聚光。
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公开(公告)号：US20230007769A1
公开(公告)日：2023-01-05
申请号：US17944294
申请日：2022-09-14
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA , Hiroyuki MOTOHARA
Abstract: An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.
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公开(公告)号：US20230000325A1
公开(公告)日：2023-01-05
申请号：US17940115
申请日：2022-09-08
Applicant: OLYMPUS CORPORATION
Inventor： Hiroyuki MOTOHARA , Shigeru HOSOKAI
Abstract: An endoscope includes an imager unit loading region formed in a distal end barrel member formed of a resin material, a cable connection surface provided on a proximal end side, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface, a plurality of contact patterns formed on a wall surface of the imager unit loading region, and configured to be electrically connected to electric contacts of an imager unit, a plurality of wiring patterns formed on a front surface of the cable connection surface from the wall, and configured to electrically continue to the plurality of contact patterns, and a plurality of connection patterns formed on the cable connection surface with larger intervals than intervals of the plurality of wiring patterns formed on the wall, with core wires of cables being electrically connected to the plurality of connection patterns.
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Patent Agency Ranking
公开(公告)号：US20230000316A1
公开(公告)日：2023-01-05
申请号：US17940208
申请日：2022-09-08
Applicant: OLYMPUS CORPORATION
Inventor： Kenjiro KANNO , Shigeru HOSOKAI , Takuro HORIBE , Daichi KODAMA , Hiroyuki MOTOHARA
Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.
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公开(公告)号：US20210369087A1
公开(公告)日：2021-12-02
申请号：US17401989
申请日：2021-08-13
Applicant: OLYMPUS CORPORATION
Inventor： Daichi KODAMA , Hiroyuki MOTOHARA , Hiroyuki NAGAMIZU
Abstract: A distal end unit of an endoscope includes: a distal end frame body that is constituted by a resin molded article configuring a molded interconnect device, that is provided with an image pickup unit containing room, and that is provided with an observation opening portion that opens the image pickup unit containing room on a distal end surface exposed to an exterior; a metal layer that is provided along a flat surface of the observation opening portion; a cover glass that closes the observation opening portion; a solder layer that is bonded to the metal layer and that holds the cover glass on the distal end frame body; and an adhesive layer that covers the solder layer, the metal layer is provided at a position corresponding to a groove provided on the flat surface, and the solder layer is disposed in an interior of the groove.
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公开(公告)号：US20210345861A1
公开(公告)日：2021-11-11
申请号：US17380291
申请日：2021-07-20
Applicant: OLYMPUS CORPORATION
Inventor： Shigeru HOSOKAI , Hiroyuki MOTOHARA
IPC: A61B1/00
Abstract: A holding frame for an imaging unit arranged at a distal end of an endoscope includes a cylindrical three-dimensional molded interconnect device; a housing configured to house the imaging unit, the housing being formed of a notch; at least one cut face formed on the side face of the holding frame and obtained by cutting a support portion which is a gate portion into which a resin is injected when the holding frame is resin-molded; a connection terminal formed on a bottom face of the housing portion and configured to be connected to the imaging unit; a cable connection electrode arranged on a face where a proximal end side of the holding frame is notched; and a wiring pattern formed on a surface area of the holding frame excluding the cut face and configured to electrically connect the connection terminal and the cable connection electrode.
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公开(公告)号：US20170150875A1
公开(公告)日：2017-06-01
申请号：US15431889
申请日：2017-02-14
Applicant: OLYMPUS CORPORATION
Inventor： Toshiyuki SHIMIZU , Hiroyuki MOTOHARA , Toshiyuki FUJII , Shinya ISHIKAWA
IPC: A61B1/05 , G02B23/24 , H01L27/146 , A61B1/00
CPC classification number: A61B1/051 , A61B1/0011 , A61B1/00124 , A61B1/04 , G02B23/24 , G02B23/2484 , H01L27/14 , H01L27/14618 , H01L27/14683
Abstract: An imaging module includes: a chip size package having an image sensor that has a light receiving unit on a front side of the image sensor, the chip size package having connection lands on a back side of the image sensor; a circuit board having connection electrodes being electrically and mechanically connected to the connection lands of the chip size package through bumps; and an underfill material filled into a gap between the chip size package and the circuit board. The circuit board and the underfill material are provided within a projection plane on which the chip size package is projected in an optical axis direction of the image sensor. The circuit board has a cutout portion on a side surface thereof orthogonal to a connection surface of the circuit board with the chip size package such that the cutout portion is open to at least the connection surface.
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20.发明申请OPTICAL ELEMENT MODULE, OPTICAL TRANSMISSION MODULE, AND METHOD OF MANUFACTURING OPTICAL TRANSMISSION MODULE 有权光学元件模块，光传输模块和制造光传输模块的方法公开(公告)号：US20140097459A1
公开(公告)日：2014-04-10
申请号：US14104345
申请日：2013-12-12
Applicant: c/o OLYMPUS CORPORATION
Inventor： Hiroyuki MOTOHARA
IPC: H01L31/0232 , H01L33/58
CPC classification number: H01L31/02325 , A61B1/00013 , G02B6/3644 , G02B6/4202 , G02B6/4239 , G02B6/4257 , H01L33/58 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01S5/02252 , H01S5/02284 , H01S5/183 , H01L2924/00014 , H01L2924/00
Abstract: An optical element module includes an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal, a board on which the optical element is mounted, and a guide holding member that has a through hole into which an optical fiber is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board. The through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber. A diameter of the light receiving unit or the light emitting unit is smaller than that of the optical fiber.
Abstract translation: 光学元件模块包括光学元件，其具有被配置为输入光信号的光接收单元或被配置为输出光信号的发光单元，安装有光学元件的基板，以及导向保持构件， 孔，光纤被配置为插入其中以将光信号输入到光接收单元或光元件的发光单元，并且被安装和布置成与光学元件对准，厚度为 董事会的方向。 通孔具有圆筒形状并且具有与光纤的外径基本相同的直径。 光接收单元或发光单元的直径小于光纤的直径。
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