公开(公告)号：US11557491B2

公开(公告)日：2023-01-17

申请号：US16669579

申请日：2019-10-31

Applicant: NXP B.V.

Inventor： Leo van Gemert ,  Peter Joseph Hubert Drummen

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L23/66

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

公开(公告)号：US20180134473A1

公开(公告)日：2018-05-17

申请号：US15352214

申请日：2016-11-15

Applicant: NXP B.V.

Inventor： Jeroen Johannes Maria Zaal ,  Roelf Anco Jacob Groenhuis ,  Leo van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx

IPC: B65D73/02 ,  H01L21/683 ,  H01L23/06 ,  H01L23/053

CPC classification number: B65D73/02 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/053 ,  H01L23/06 ,  H01L2221/68309 ,  H01L2221/68313

Abstract: One example discloses a component carrier, including: a cavity; wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and wherein the cavity registration features are within the cavity.