公开(公告)号：US10969659B2

公开(公告)日：2021-04-06

申请号：US16345461

申请日：2017-11-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Ok Park ,  Tae Young Kim ,  Hyun Ah Oh ,  Youn Baek Jeong

IPC: G03B17/12 ,  G03B17/02 ,  G03B19/22 ,  H04N5/225 ,  H01F7/08 ,  H01F7/16 ,  H04N5/232 ,  H04N5/247 ,  H04N5/335

Abstract: The present embodiment relates to a dual camera module comprising: a rigid first substrate having a first image sensor arranged thereon; a rigid second substrate spaced apart from the first substrate and having a second image sensor arranged thereon; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit for connecting the first substrate to the second substrate, wherein the first substrate includes a first side surface, the second substrate includes a second side surface facing the first side surface, and the connection unit connects the first side surface of the first substrate to the second side surface of the second substrate.

公开(公告)号：US10277791B2

公开(公告)日：2019-04-30

申请号：US15414761

申请日：2017-01-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Min Ha ,  Hyun Ah Oh

IPC: H04N5/225 ,  H01L31/0203 ,  G02B27/64 ,  G02B7/08 ,  H04M1/02 ,  H04B1/3827

Abstract: The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.

公开(公告)号：US20170214831A1

公开(公告)日：2017-07-27

申请号：US15414761

申请日：2017-01-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Min Ha ,  Hyun Ah Oh

IPC: H04N5/225 ,  G02B7/09 ,  H05K1/18 ,  G02B27/64

CPC classification number: H04N5/2257 ,  G02B7/08 ,  G02B27/646 ,  H04B1/3827 ,  H04M1/0264 ,  H04N5/2253 ,  H04N5/2254

Abstract: The present disclosure relates to a camera module, the camera module including a circuit board, an image sensor disposed on an upper surface of the circuit board, a current carrying part electrically connecting the image sensor and the circuit board, and a base disposed on the upper surface of the circuit board, wherein the base is not overlapped with the image sensor and the current carrying part in a direction of an optical axis.