公开(公告)号：US06618239B2

公开(公告)日：2003-09-09

申请号：US10068003

申请日：2002-02-08

申请人： Kouki Takahashi ,  Kouji Ishikawa ,  Kiyokazu Moriizumi ,  Kiyoshi Wada ,  Katsumi Harada ,  Junichi Maruyama ,  Yasuo Yatsuda ,  Kazutoshi Hayashi ,  Toshiaki Tanaka

发明人： Kouki Takahashi ,  Kouji Ishikawa ,  Kiyokazu Moriizumi ,  Kiyoshi Wada ,  Katsumi Harada ,  Junichi Maruyama ,  Yasuo Yatsuda ,  Kazutoshi Hayashi ,  Toshiaki Tanaka

IPC分类号： H05K700

CPC分类号： H01H3/125

摘要： A key switch includes a switch provided on a base, a key top for operating the switch, and a link mechanism supported on the base and supporting the key top on its upper side, a shape of the link mechanism being changed when the key top is depressed. A movable plate is provided on the base, in stacked relationship; such that the movable plate is moved when the key top is depressed so as to change the shape of the link mechanism to a flat shape. An auxiliary link mechanism has a first part supported on the moveable plate and, in turn, by the base and a second part supporting the key top.

摘要翻译： 键开关包括设置在基座上的开关，用于操作开关的键顶，以及支撑在基座上并且支撑其上侧的键顶的连杆机构，当键顶是 郁闷。 底座上设有可动板，堆叠关系; 使得当键顶被压下时移动板移动，以便将连杆机构的形状改变为平坦的形状。 辅助连杆机构具有支撑在可移动板上的第一部分，又由基座支撑的第二部分和支撑键顶部的第二部分。

公开(公告)号：US06410983B1

公开(公告)日：2002-06-25

申请号：US09512657

申请日：2000-02-24

申请人： Kiyokazu Moriizumi ,  Satoshi Osawa

发明人： Kiyokazu Moriizumi ,  Satoshi Osawa

IPC分类号： H01L2312

CPC分类号： H05K1/141 ,  H01L23/5385 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10674 ,  H05K2201/10704 ,  H01L2224/05599

摘要： A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.

摘要翻译： 在半导体器件中并入多个多芯片模块。 每个多芯片模块具有安装在电路板上的多个功能部件。 柔性线路板将多芯片模块相互连接。 接口部分安装在柔性布线板上，以便控制多芯片模块的输入和输出信号。

公开(公告)号：US06303877B2

公开(公告)日：2001-10-16

申请号：US09109912

申请日：1998-07-02

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Naomi Fukunaga

IPC分类号： H01R909

CPC分类号： H05K1/115 ,  H01L23/49816 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2924/15322 ,  H05K1/113 ,  H05K3/467 ,  H05K2201/096 ,  H05K2201/0979

摘要： A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.

摘要翻译： 一种多层薄膜布线板，包括设置有多个布线层的基材和层叠在基材上的绝缘层，并且包括通过层叠布线层而形成的通孔，以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔，多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。

公开(公告)号：US6054652A

公开(公告)日：2000-04-25

申请号：US942387

申请日：1997-10-10

申请人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

发明人： Kiyokazu Moriizumi ,  Shunichi Kikuchi ,  Kazuhiro Nitta ,  Naomi Fukunaga ,  Mitsuo Suehiro

IPC分类号： H05K3/34 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

CPC分类号： H01L23/5384 ,  H01L23/49811 ,  H05K1/112 ,  H01L2224/16225 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K1/0298 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10318 ,  H05K3/467

摘要： The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.

摘要翻译： 薄膜多层基板包括绝缘基板基板和包括多个导电层和形成在基板基板上的多个绝缘层的薄膜结构。 在薄膜结构中形成通孔结构并连接到薄层结构的导电层之一。 引脚连接到通孔结构，使得通孔结构的底部直接层压在基板基板上，并且引脚固定到通孔结构上。

公开(公告)号：US5496971A

公开(公告)日：1996-03-05

申请号：US297419

申请日：1994-08-29

申请人： Kiyokazu Moriizumi ,  Mikio Nishihara

发明人： Kiyokazu Moriizumi ,  Mikio Nishihara

IPC分类号： H05K1/11 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： H01L23/5386 ,  H05K1/0289 ,  H01L2924/0002 ,  H05K2201/10689

摘要： In a circuit arrangement for a multilayer printed circuit board, a first circuit layer is formed on a substrate, and comprises a dielectric layer having a circuit pattern formed thereon. A second circuit layer is further formed on the first circuit layer, and comprises a dielectric layer having a circuit pattern formed thereon. The first circuit pattern includes conductive segments having only an X-directional component, and the second circuit pattern includes conductive segments having only an Y-directional component perpendicular to the X-directional component. Electric connections between the X-directional segments and the Y-directional segments are suitably established by vias provided in the second layer. The first circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the X-directional segments, and the second circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the Y-directional segments. Electric connections between the slant segments of the first pattern and the slant segments of the second pattern are suitably established by vias provided in the second layer.

摘要翻译： 在多层印刷电路板的电路装置中，在基板上形成第一电路层，并且包括其上形成有电路图案的电介质层。 第二电路层还形成在第一电路层上，并且包括其上形成有电路图案的电介质层。 第一电路图案包括仅具有X方向分量的导电段，并且第二电路图案包括仅具有垂直于X方向分量的Y方向分量的导电段。 X方向段和Y方向段之间的电连接通过设置在第二层中的通孔适当地建立。 第一电路图案还包括具有X方向和Y方向分量两者并且布置在未被X方向段占据的空白区域中的倾斜导电段，并且第二电路图案还包括倾斜的导电段，其具有X和 Y方向组件并且布置在未被Y方向段占据的空白区域中。 第一图案的倾斜段与第二图案的倾斜段之间的电连接通过设置在第二层中的通孔适当地建立。

公开(公告)号：US20110208484A1

公开(公告)日：2011-08-25

申请号：US13019070

申请日：2011-02-01

申请人： Kouhei EZAKI ,  Kiyokazu Moriizumi ,  Takayuki Watanabe ,  Yuji Maeda

发明人： Kouhei EZAKI ,  Kiyokazu Moriizumi ,  Takayuki Watanabe ,  Yuji Maeda

IPC分类号： G06F17/50

CPC分类号： G06F17/5045

摘要： A design apparatus for an electronic device is provided. The apparatus includes: a selection unit that selects a first component which meets a characteristic condition, from a component database which includes a characteristic and a recommended level of each of components, the recommended level being variable; a first determination unit that acquires a recommended level of the first component from the component database, and determines the acquired recommended level; a creation unit that creates design data of the electronic device including the first component; and a second determination unit that acquires, after the creation, a recommended level of the first component from the component database, and determines the acquired recommended level after the creation.

摘要翻译： 提供了一种用于电子设备的设计装置。 所述装置包括：选择单元，从包括每个组件的特征和推荐级别的组件数据库中选择满足特征状态的第一组件，所述推荐级别是可变的; 第一确定单元，从所述组件数据库获取所述第一组件的推荐级别，并且确定所获取的推荐级别; 创建单元，其创建包括所述第一组件的所述电子设备的设计数据; 以及第二确定单元，其在创建之后从所述组件数据库获取所述第一组件的推荐级别，并且在创建之后确定所获取的推荐级别。

公开(公告)号：US20100246149A1

公开(公告)日：2010-09-30

申请号：US12718348

申请日：2010-03-05

申请人： Tomokazu Nakashima ,  Kiyokazu Moriizumi ,  Masayuki Itoh

发明人： Tomokazu Nakashima ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC分类号： H05K7/02 ,  H01R12/02

CPC分类号： H01L23/50 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/023 ,  H05K1/145 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10719 ,  Y02P70/611

摘要： A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.

摘要翻译： 连接构件设置在半导体封装和印刷线路板之间。 连接构件包括：由绝缘材料形成的基底构件; 多个通孔，其设置在所述基底构件中，在所述半导体封装的多个第一端子焊盘与所述印刷电路板的多个第二端子焊盘之间的对应位置处; 以及插入到所述多个通孔中的电子部件，所述电子部件在其端部具有第一电极和第二电极，所述第一电极与所述第一端子焊盘中的一个连接，所述第二电极连接到所述第二端子 垫

公开(公告)号：US20100124952A1

公开(公告)日：2010-05-20

申请号：US12606635

申请日：2009-10-27

申请人： Kiyokazu Moriizumi ,  Kouhei Ezaki ,  Yoshinori Mesaki

发明人： Kiyokazu Moriizumi ,  Kouhei Ezaki ,  Yoshinori Mesaki

IPC分类号： H04M1/00

CPC分类号： H01Q1/243 ,  H01Q1/103 ,  H04M1/0241

摘要： A mobile terminal device having communicating functions includes a housing; an antenna housed in the housing to be freely pulled out; a pull-out mechanism that pulls out the antenna from within the housing in accordance with an instruction to pull out the antenna; and an instructing section that gives the instruction to pull-out the antenna to the pull-out mechanism in accordance with a predetermined event for any one of the communicating functions.

摘要翻译： 具有通信功能的移动终端设备包括壳体; 天线收纳在壳体中以便自由拉出; 拉出机构，其根据拉出天线的指令从壳体内拉出天线; 以及指令部，其根据用于任何一个通信功能的预定事件给出将天线拉出到拉出机构的指令。

公开(公告)号：US07298605B2

公开(公告)日：2007-11-20

申请号：US11234161

申请日：2005-09-26

申请人： Masayuki Itoh ,  Kiyokazu Moriizumi ,  Takao Ishikawa ,  Tomokazu Nakashima ,  Masako Okazaki

发明人： Masayuki Itoh ,  Kiyokazu Moriizumi ,  Takao Ishikawa ,  Tomokazu Nakashima ,  Masako Okazaki

IPC分类号： H01G2/10 ,  H01G9/08

CPC分类号： H01G2/12 ,  H01G9/08 ,  H01G9/12

摘要： The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.

摘要翻译： 本发明提供了一种低成本的电解电容器，其中防止由于回流期间的热膨胀引起的壳体的变形。 具有由电介质膜和电极箔构成的电容器元件的表面安装型电解电容器，保持电容器元件的金属壳体和浸渍在壳体内的电容器元件浸渍的电解液， 壳体配备有吸收壳体中产生的气体的气体吸收构件。

公开(公告)号：US06717262B1

公开(公告)日：2004-04-06

申请号：US09705897

申请日：2000-11-06

申请人： Kiyokazu Moriizumi ,  Manabu Watanabe

发明人： Kiyokazu Moriizumi ,  Manabu Watanabe

IPC分类号： H01L2348

CPC分类号： H05K3/243 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/113 ,  H05K3/062 ,  H05K3/108 ,  H05K3/28 ,  H05K3/388 ,  H05K3/389 ,  H05K3/467 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/025 ,  H01L2224/0401

摘要： A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.

摘要翻译： 安装的电路基板具有至少一个导电层。 元件安装焊盘的侧面形成在基板的表面上，并且至少包括由金属制成的柱状图案，该金属具有高度耐焊接侵蚀的金属。元件安装焊盘的侧面被完全覆盖有机绝缘层 。 因此，即使部件更换多次，组件安装垫也可以承受伴随部件更换的熔融焊料应力。