公开(公告)号：US20140328043A1

公开(公告)日：2014-11-06

申请号：US14336810

申请日：2014-07-21

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

IPC: G01N21/88 ,  F21V23/00

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

公开(公告)号：US20140139829A1

公开(公告)日：2014-05-22

申请号：US14036360

申请日：2013-09-25

Applicant: KLA-TENCOR CORPORATION

Inventor： Christian Wolters ,  Zhiwei Xu ,  Juergen Reich

IPC: G01N21/95

CPC classification number: G01N21/9501

Abstract: Methods and systems for reshaping the beam intensity distribution of an illumination light supplied to a specimen under inspection are presented. A scanning surface inspection system includes a beam shaping element that flattens the beam intensity distribution of a beam of light generated by an illumination source. The reshaped illumination light is directed to the wafer surface over an illumination spot. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location. In addition, the illumination spot is shaped by the beam shaping element to have a variable beam width in a direction parallel to the inspection track. The location of a defect within an inspection area having a variable beam width is estimated based on an analysis of the output of the detector.

Abstract translation: 提出了改造供应给检验样本的照明光束的光束强度分布的方法和系统。 扫描表面检查系统包括光束成形元件，其平坦化由照明源产生的光束的光束强度分布。 重新整形的照明光在照明点上被引导到晶片表面。 通过平坦的光束强度分布，可以增加入射光束功率，而不会使光束强度超过任何特定位置的晶片的损伤阈值。 此外，照明光斑通过光束成形元件成形，以在与检查轨道平行的方向上具有可变的光束宽度。 基于对检测器的输出的分析来估计具有可变波束宽度的检查区域内的缺陷的位置。

公开(公告)号：US20140071437A1

公开(公告)日：2014-03-13

申请号：US13794030

申请日：2013-03-11

Applicant: KLA-Tencor Corporation

Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

IPC: G01J1/42

CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。