公开(公告)号：US09194812B2

公开(公告)日：2015-11-24

申请号：US14336810

申请日：2014-07-21

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95 ,  F21V23/00

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。

公开(公告)号：US20170336329A1

公开(公告)日：2017-11-23

申请号：US15477885

申请日：2017-04-03

Applicant: KLA-Tencor Corporation

Inventor： Frank Li ,  Zhiwei Xu ,  Timothy Swisher ,  Kwan Auyeung ,  Yury Yuditsky

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G02B26/108

Abstract: A system includes a beam steering assembly configured to adjust an incident beam to form a corrected beam; a beam monitoring assembly configured to generate monitoring data for the corrected beam including one or more offset parameters of the corrected beam; and a controller configured to store one or more zero parameters of the corrected beam, calculate at least one difference between the one or more zero parameters and the one or more offset parameters of the corrected beam, determine one or more beam position adjustments of the incident beam based on the at least one difference between the one or more zero parameters and the one or more offset parameters of the corrected beam, and direct the beam steering assembly via one or more motor drivers to actuate one or more motors to adjust the incident beam to form the corrected beam.

公开(公告)号：US09255891B2

公开(公告)日：2016-02-09

申请号：US14036360

申请日：2013-09-25

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Zhiwei Xu ,  Juergen Reich

IPC: G01N21/00 ,  G01N21/95

CPC classification number: G01N21/9501

Abstract: Methods and systems for reshaping the beam intensity distribution of an illumination light supplied to a specimen under inspection are presented. A scanning surface inspection system includes a beam shaping element that flattens the beam intensity distribution of a beam of light generated by an illumination source. The reshaped illumination light is directed to the wafer surface over an illumination spot. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location. In addition, the illumination spot is shaped by the beam shaping element to have a variable beam width in a direction parallel to the inspection track. The location of a defect within an inspection area having a variable beam width is estimated based on an analysis of the output of the detector.

Abstract translation: 提出了改造供应给检验样本的照明光束的光束强度分布的方法和系统。 扫描面检查系统包括使由照明源产生的光束的光束强度分布变平的光束成形元件。 重新整形的照明光在照明点上被引导到晶片表面。 通过平坦的光束强度分布，可以增加入射光束功率，而不会使光束强度超过任何特定位置的晶片的损伤阈值。 此外，照明光斑通过光束成形元件成形，以在与检查轨道平行的方向上具有可变的光束宽度。 基于对检测器的输出的分析来估计具有可变波束宽度的检查区域内的缺陷的位置。

公开(公告)号：US20140328043A1

公开(公告)日：2014-11-06

申请号：US14336810

申请日：2014-07-21

Applicant: KLA-Tencor Corporation

Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

IPC: G01N21/88 ,  F21V23/00

CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

公开(公告)号：US20140139829A1

公开(公告)日：2014-05-22

申请号：US14036360

申请日：2013-09-25

Applicant: KLA-TENCOR CORPORATION

Inventor： Christian Wolters ,  Zhiwei Xu ,  Juergen Reich

IPC: G01N21/95

CPC classification number: G01N21/9501

Abstract: Methods and systems for reshaping the beam intensity distribution of an illumination light supplied to a specimen under inspection are presented. A scanning surface inspection system includes a beam shaping element that flattens the beam intensity distribution of a beam of light generated by an illumination source. The reshaped illumination light is directed to the wafer surface over an illumination spot. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location. In addition, the illumination spot is shaped by the beam shaping element to have a variable beam width in a direction parallel to the inspection track. The location of a defect within an inspection area having a variable beam width is estimated based on an analysis of the output of the detector.

Abstract translation: 提出了改造供应给检验样本的照明光束的光束强度分布的方法和系统。 扫描表面检查系统包括光束成形元件，其平坦化由照明源产生的光束的光束强度分布。 重新整形的照明光在照明点上被引导到晶片表面。 通过平坦的光束强度分布，可以增加入射光束功率，而不会使光束强度超过任何特定位置的晶片的损伤阈值。 此外，照明光斑通过光束成形元件成形，以在与检查轨道平行的方向上具有可变的光束宽度。 基于对检测器的输出的分析来估计具有可变波束宽度的检查区域内的缺陷的位置。