-
公开(公告)号：US20170111616A1
公开(公告)日：2017-04-20
申请号：US15395661
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Wenlong Li , Xiaofeng Tong , Yangzhou Du , Qiang Eric Li , Yimin Zhang , Wei Hu , John G. Tennant , Hui A. Li
CPC classification number: H04N7/157 , G06K9/00248 , G06K9/00255 , G06K9/00268 , G06K9/00281 , G06K9/00308 , G06T13/40 , H04N7/147 , H04N21/4223 , H04N21/44008 , H04N21/4788 , H04N21/8146
Abstract: Generally this disclosure describes a video communication system that replaces actual live images of the participating users with animated avatars. A method may include selecting an avatar, initiating communication, capturing an image, detecting a face in the image, extracting features from the face, converting the facial features to avatar parameters, and transmitting at least one of the avatar selection or avatar parameters.
-
公开(公告)号：US20150332466A1
公开(公告)日：2015-11-19
申请号：US14798198
申请日：2015-07-13
Applicant: INTEL CORPORATION
Inventor： Wei Hu , Zhixiang He
CPC classification number: G06K9/00268 , G06K9/00201 , G06K9/00241 , G06K9/00362 , G06K9/6202 , G06K9/6203 , G06T7/11 , G06T7/194 , G06T7/74 , G06T2207/10028 , G06T2207/20076 , G06T2207/30196
Abstract: Systems, devices and methods are described including receiving a depth image and applying a template to pixels of the depth image to determine a location of a human head in the depth image. The template includes a circular shaped region and a first annular shaped region surrounding the circular shaped region. The circular shaped region specifies a first range of depth values. The first annular shaped region specifies a second range of depth values that are larger than depth values of the first range of depth values.
Abstract translation: 描述了系统，设备和方法，包括接收深度图像并将模板应用于深度图像的像素，以确定人类头部在深度图像中的位置。 模板包括圆形区域和围绕圆形区域的第一环形区域。 圆形区域指定深度值的第一范围。 第一环形区域指定深度值的第二范围，其大于深度值的第一范围的深度值。
-
公开(公告)号：US20230283748A1
公开(公告)日：2023-09-07
申请号：US18162231
申请日：2023-01-31
Applicant: Intel Corporation
Inventor： Xiaofeng Tong , Wenlong Li , Yangzhou Du , Wei Hu , Yimin Zhang
IPC: H04N7/15 , H04M1/72439 , G06V40/16 , G06T13/40 , H04N7/14 , G06F3/0482 , G06F3/04883 , G10L21/003 , G10L21/013
CPC classification number: H04N7/157 , H04M1/72439 , G06V40/166 , G06V40/168 , G06T13/40 , H04N7/147 , G06F3/0482 , G06F3/04883 , G10L21/003 , G10L21/013
Abstract: Generally this disclosure describes a video communication system that replaces actual live images of the participating users with animated avatars. A method may include selecting an avatar; initiating communication; detecting a user input; identifying the user input; identifying an animation command based on the user input; generating avatar parameters; and transmitting at least one of the animation command and the avatar parameters.
-
公开(公告)号：US11595617B2
公开(公告)日：2023-02-28
申请号：US17550480
申请日：2021-12-14
Applicant: Intel Corporation
Inventor： Xiaofeng Tong , Wenlong Li , Yangzhou Du , Wei Hu , Yimin Zhang
IPC: H04N7/15 , H04M1/72439 , G06V40/16 , G06T13/40 , H04N7/14 , G06F3/0482 , G06F3/04883 , G10L21/003 , G10L21/013
Abstract: Generally this disclosure describes a video communication system that replaces actual live images of the participating users with animated avatars. A method may include selecting an avatar; initiating communication; detecting a user input; identifying the user input; identifying an animation command based on the user input; generating avatar parameters; and transmitting at least one of the animation command and the avatar parameters.
-
公开(公告)号：US20210235020A1
公开(公告)日：2021-07-29
申请号：US15734505
申请日：2018-12-28
Applicant: Intel Corporation
Inventor： Wei Hu , Jianxin Fan
Abstract: An example apparatus for tracking objects includes a controller to receive a depth map, a focus distance, and an image frame of an object to be tracked. The controller is to detect the object to be tracked in the image frame and generate an object position for the object in the image frame. The controller is to calculate a deflection angle for the object based on the depth map, the focus distance, and the object position. The controller is to further rotate an imaging sensor based on the deflection angle.
-
Patent Agency Ranking
公开(公告)号：US10969840B2
公开(公告)日：2021-04-06
申请号：US15768915
申请日：2015-11-16
Applicant: Intel Corporation
Inventor： Aravindha R. Antoniswamy , Syadwad Jain , Zhizhong Tang , Wei Hu
IPC: G06F1/20 , H01L21/48 , H01L23/40 , H01L23/373 , H01L23/367 , H01L23/36
Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.
-
17.发明授权Multi-solder techniques and configurations for integrated circuit package assembly 有权用于集成电路封装组装的多焊接技术和配置公开(公告)号：US09257405B2
公开(公告)日：2016-02-09
申请号：US14328599
申请日：2014-07-10
Applicant: INTEL CORPORATION
Inventor： Rajen S. Sidhu , Wei Hu , Carl L. Deppisch , Martha A. Dudek
CPC classification number: H01L24/14 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/362 , H01L21/4853 , H01L23/3128 , H01L23/49816 , H01L2224/14505 , H01L2224/16225 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/00
Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。
-
公开(公告)号：US20230314508A1
公开(公告)日：2023-10-05
申请号：US17712100
申请日：2022-04-02
Applicant: Intel Corporation
Inventor： Elik Haran , Nir Gerber , Tal Davidson , Wei Hu , Nadav Levison
IPC: G01R31/3183 , G01R31/3187 , G01R31/3185
CPC classification number: G01R31/318307 , G01R31/318597 , G01R31/3187
Abstract: Embodiments of apparatuses and methods for in-field testing of an integrated circuit (IC) are disclosed. In an embodiment, an apparatus includes an IC having circuitry to operate in a structural test mode, the structural test mode including a memory built-in self-test (MBIST) mechanism and an automatic test pattern generation (ATPG) mechanism; a microcontroller to enable and control the structural test mode during in-field operation of the IC; and a programmable logic device to support the ATPG mechanism.
-
公开(公告)号：US11423508B2
公开(公告)日：2022-08-23
申请号：US16770320
申请日：2018-02-26
Applicant: INTEL CORPORATION
Inventor： Yimin Zhang , Haibing Ren , Wei Hu , Ping Guo
Abstract: A system, article, and method of point cloud registration using overlap regions for image processing.
-
公开(公告)号：US20190006259A1
公开(公告)日：2019-01-03
申请号：US15637107
申请日：2017-06-29
Applicant: Intel Corporation
Inventor： Dinesh Padmanabhan Ramalekshmi Thanu , Wei Hu , James C. Matayabas, JR. , Baris Bicen , Luke J. Garner , Hemanth Dhavaleswarapu
IPC: H01L23/367 , H01L25/065 , H01L23/00
Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a first die disposed on a substrate and a second die disposed adjacent the first die on the substrate. A cooling solution is attached to the substrate, wherein a rib extends from a central region of the cooling solution and is attached to the substrate. The rib is disposed between the first die and the second die.
-
-
-
-
-
-
-
-
-
Search Results
35
records
(took 0.016 seconds)
