公开(公告)号：US20180059893A1

公开(公告)日：2018-03-01

申请号：US15556979

申请日：2015-07-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jie Xu ,  Jin Wang ,  Gang Wu

IPC: G06F3/0484 ,  G06F3/041 ,  G06F3/0488

CPC classification number: G06F3/0484 ,  G06F1/1626 ,  G06F1/169 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/0488 ,  G06F2203/04105

Abstract: A surface of the terminal device is provided with three touch regions that correspond respectively to three system navigation functions, and the three system navigation functions include back, home, and recent app. The method includes, when the terminal device detects a pressure that is exerted on one of the three touch regions and whose magnitude exceeds a preset value, implementing a system navigation function corresponding to the touch region on which the pressure is exerted. In addition to common tap and touch and hold operations, the operation method can provide a force touch operation manner for a user to quickly and conveniently operate a system navigation function.

公开(公告)号：US20180042141A1

公开(公告)日：2018-02-08

申请号：US15785159

申请日：2017-10-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhongjiang Qu ,  Shanjiu Chi ,  Yangfan Zhong ,  Jin Wang

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20736 ,  H05K7/1489 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20181 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20745 ,  H05K7/20818

Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.