Method and device for line pattern shape evaluation

    公开(公告)号:US09658063B2

    公开(公告)日:2017-05-23

    申请号:US14897609

    申请日:2014-05-27

    Abstract: The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.

    Measurement method, image processing device, and charged particle beam apparatus
    13.
    发明授权
    Measurement method, image processing device, and charged particle beam apparatus 有权
    测量方法,图像处理装置和带电粒子束装置

    公开(公告)号:US09536170B2

    公开(公告)日:2017-01-03

    申请号:US14404499

    申请日:2013-05-27

    Abstract: An error of an outline point due to a brightness fluctuation cannot be corrected by a simple method such as a method of adding a certain amount of offset. However, in recent years as the miniaturization of the pattern represented by a resist pattern has progressed, it has been difficult to appropriately determine a region that serves as a reference. An outline of the resist pattern is extracted from an image of the resist pattern obtained by a charged particle beam apparatus in consideration of influence of the brightness fluctuation. That is, a plurality of brightness profiles in the vicinity of edge points configuring the outline are obtained and an evaluation value of a shape of the brightness profile in the vicinity of a specific edge is obtained based on the plurality of brightness profiles, and the outline of a specific edge point is corrected, based on the evaluation value.

    Abstract translation: 由于亮度波动导致的轮廓点的误差不能通过添加一定量的偏移量的方法等简单的方法来校正。 然而,近年来,随着抗蚀剂图案表示的图案的小型化进行,难以适当地确定作为基准的区域。 考虑到亮度波动的影响,从由带电粒子束装置得到的抗蚀剂图案的图像中提取抗蚀剂图案的轮廓。 也就是说,获得构成轮廓的边缘点附近的多个亮度轮廓,并且基于多个亮度轮廓获得特定边缘附近的亮度轮廓的形状的评估值,并且轮廓 基于评估值来校正特定边缘点。

    Measuring method, data processing apparatus and electron microscope using same
    14.
    发明授权
    Measuring method, data processing apparatus and electron microscope using same 有权
    测量方法,数据处理设备和电子显微镜使用相同

    公开(公告)号:US09305744B2

    公开(公告)日:2016-04-05

    申请号:US14349375

    申请日:2012-09-27

    Abstract: The objective of the invention is to provide a measuring method that can determine pattern contours and dimensions with high precision even if an object to be measured shrinks due to electron beam radiations. In order to achieve this objective, a method, which performs measurements by irradiating an electron beam onto a sample having a pattern formed on a primary coating thereof, prepares an SEM image and contour of the pattern (S201, S202), material parameters of the pattern part and primary coating part of the sample (S203, S204), and a beam condition in irradiating the electron beam onto the sample (S205), and uses these prepared things to calculate a pattern shape or dimensions before the irradiation of the electron beam (S206).

    Abstract translation: 本发明的目的是提供一种能够以高精度确定图形轮廓和尺寸的测量方法,即使被测量物体由于电子束辐射而收缩。 为了实现该目的,通过将电子束照射到形成在其一次涂层上的图案的样品上进行测量的方法准备SEM图像和图案的轮廓(S201,S202),材料参数 样品的图案部分和初次涂布部分(S203,S204),以及将电子束照射到样品上的光束条件(S205),并且使用这些制备的物体来计算电子束照射之前的图案形状或尺寸 (S206)。

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