公开(公告)号：US20180094875A1

公开(公告)日：2018-04-05

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H05K7/20 ,  H01L23/473

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20180018000A1

公开(公告)日：2018-01-18

申请号：US15546050

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John P. Franz ,  David A. Moore

IPC: G06F1/20 ,  G05B19/4099 ,  H05K7/20

CPC classification number: G06F1/20 ,  B29C64/393 ,  B33Y50/02 ,  B33Y80/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772

Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.

公开(公告)号：US10833438B1

公开(公告)日：2020-11-10

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US20200350714A1

公开(公告)日：2020-11-05

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R12/71 ,  H01R13/11

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US10458724B2

公开(公告)日：2019-10-29

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F27/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US10330395B2

公开(公告)日：2019-06-25

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F7/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20190059178A1

公开(公告)日：2019-02-21

申请号：US16078224

申请日：2016-02-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  John Franz ,  Jonathon Hughes ,  Rahul V. Joshi ,  John Vijil

IPC: H05K7/20

Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.

公开(公告)号：US20180317347A1

公开(公告)日：2018-11-01

申请号：US15772903

申请日：2015-12-18

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  David A. Moore ,  Greg Scott Long

IPC: H05K7/20 ,  G05D7/06 ,  G05B15/02

CPC classification number: G06F1/20 ,  G06F17/5009 ,  H05K7/2079 ,  H05K7/20836

Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.

公开(公告)号：US20180017341A1

公开(公告)日：2018-01-18

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H01L23/473 ,  H05K7/20

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US11705652B2

公开(公告)日：2023-07-18

申请号：US16949372

申请日：2020-10-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

CPC classification number: H01R12/707 ,  H01R12/716 ,  H01R13/113 ,  H05K1/181 ,  H05K2201/10189

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.