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公开(公告)号：US11705652B2
公开(公告)日：2023-07-18
申请号：US16949372
申请日：2020-10-27
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Jian Miremadi , David A. Moore , John Norton , Eduardo F. Velazquez
CPC classification number: H01R12/707 , H01R12/716 , H01R13/113 , H05K1/181 , H05K2201/10189
Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
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Patent Agency Ranking
公开(公告)号：US20230059410A1
公开(公告)日：2023-02-23
申请号：US17404097
申请日：2021-08-17
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Jaime E. Llinas , Saravanan Rathakrishnan , Yanyan Xia , ZeLin Wu , Yanli Li , JunHui Li , Jian Miremadi
Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.
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公开(公告)号：US20210044039A1
公开(公告)日：2021-02-11
申请号：US16949372
申请日：2020-10-27
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Jian Miremadi , David A. Moore , John Norton , Eduardo F. Velazquez
Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
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公开(公告)号：US11927436B2
公开(公告)日：2024-03-12
申请号：US17404097
申请日：2021-08-17
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Jaime E. Llinas , Saravanan Rathakrishnan , Yanyan Xia , ZeLin Wu , Yanli Li , JunHui Li , Jian Miremadi
IPC: G01B15/00 , G01B9/04 , G01B11/02 , G01N21/956 , G01B21/04
CPC classification number: G01B15/00 , G01B9/04 , G01B11/02 , G01N21/956 , G01B21/042 , G01N2021/95638 , G01N2021/95669
Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.
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公开(公告)号：US10833438B1
公开(公告)日：2020-11-10
申请号：US16400540
申请日：2019-05-01
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Jian Miremadi , David A. Moore , John Norton , Eduardo F. Velazquez
Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
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公开(公告)号：US20200350714A1
公开(公告)日：2020-11-05
申请号：US16400540
申请日：2019-05-01
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Jian Miremadi , David A. Moore , John Norton , Eduardo F. Velazquez
Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
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