公开(公告)号：US20210044039A1

公开(公告)日：2021-02-11

申请号：US16949372

申请日：2020-10-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H01R13/11 ,  H01R12/71 ,  H05K1/18

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US11705652B2

公开(公告)日：2023-07-18

申请号：US16949372

申请日：2020-10-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

CPC classification number: H01R12/707 ,  H01R12/716 ,  H01R13/113 ,  H05K1/181 ,  H05K2201/10189

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US10833438B1

公开(公告)日：2020-11-10

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US20200350714A1

公开(公告)日：2020-11-05

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R12/71 ,  H01R13/11

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.