公开(公告)号：US11381315B2

公开(公告)日：2022-07-05

申请号：US17156073

申请日：2021-01-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak Han ,  Seok Jun Yun ,  Seoktae Kim ,  Sang Ho Park ,  Yongsoon Baek ,  Jang Uk Shin ,  Seo Young Lee

IPC: H04B10/50 ,  H01S3/00 ,  H01S3/23 ,  H04J14/02 ,  H04Q11/00 ,  G02B6/12

Abstract: Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.

公开(公告)号：US10146071B2

公开(公告)日：2018-12-04

申请号：US15596566

申请日：2017-05-16

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak Han ,  Sang Ho Park ,  Yongsoon Baek ,  Jang Uk Shin ,  Dong Hyo Lee ,  Dong-Hun Lee

IPC: G02F1/025 ,  H01L23/00 ,  G02F1/015

Abstract: Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.

公开(公告)号：US09069146B2

公开(公告)日：2015-06-30

申请号：US14294603

申请日：2014-06-03

Applicant: Electronics and Telecommunications Research Institute

Inventor： Young-Tak Han ,  Jang Uk Shin ,  Sang-Pil Han ,  Sang Ho Park ,  Yongsoon Baek

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4279 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/325 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4257 ,  G02B6/4265 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4281 ,  G02B2006/12092 ,  G02B2006/12135

Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

Abstract translation: 提供了一种光学模块。 光学模块包括：光学台，其具有第一深度的第一沟槽和第二深度的第二沟槽，其低于第一深度; 在光学工作台的第一沟槽中的透镜; 在所述光学平台的所述第二沟槽中的至少一个半导体芯片; 以及覆盖除了第一和第二沟槽之外的光学台的上表面的柔性印刷电路板，其中所述光学台是金属光学台或硅光学台。