Abstract:
A method of manufacturing a semiconductor device includes depositing material on a wafer in a process chamber to form a thin film on the wafer, a by-product layer being simultaneously formed on an inner part of the process chamber, monitoring a change in thickness or mass of the by-product layer on the inner part of the process chamber during a process in the process chamber by using a QCM installed in the process chamber, and determining an end point of the process in the process chamber based on the monitored change in thickness or mass of the by-product layer in the process chamber.
Abstract:
An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.
Abstract:
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
Abstract:
Disclosed herein is an antenna that can be manufactured in a smaller size and can achieve good wideband characteristics. The antenna includes a substantially semicircular antenna component installed in a monopole or dipole structure. Power is supplied to an end of the diameter of the antenna component.
Abstract:
An antenna device for a portable terminal, which allows a whip antenna and helical antenna of a terminal to be retracted and withdrawn along an extension from the terminal, while not causing them to protrude out of the terminal. The antenna device provided with a whip antenna and helical antenna further includes an antenna housing disposed at a desired position in the main body, which permits the whip antenna to be retracted and withdrawn through the helical antenna, while causing the helical antenna to be withdrawn along an extension from the main body at the same time, and permits the helical antenna to be retracted, so that it can be inserted into the main body; and a housing coupling portion disposed in the main body for supporting the antenna housing.
Abstract:
Disclosed herein are a method and an apparatus for preparing a metal composite powder by using gas spraying. The method of preparing a metal composite powder by using gas spraying includes introducing a matrix phase in a chamber, including a reinforcing phase in the chamber, melting the introduced matrix phase to form a melt, adding the reinforcing phase in the melt, stirring the melt with the added reinforcing phase to form a melt mixture, atomizing the melt mixture together with a gas to form a metal composite powder containing the reinforcing phase, and collecting the metal composite powder formed.
Abstract:
Provided are a color to grayscale image conversion method of converting a color image into a grayscale image while maintaining original features of the color image, and a recording medium storing a program for performing the same. When an original color image is input, a target gradient with the features of the input original color image is acquired, and a global mapping function for converting the original color image into a grayscale image is determined based on the acquired target gradient. Thereafter, the original color image is converted into a grayscale image using the determined global mapping function. Therefore, it is possible to quickly convert a color image into a grayscale image, and to acquire a high-quality grayscale image with features of color difference included in the original color image.
Abstract:
A method for manufacturing a gallium nitride (GaN) wafer is provided. In the method for manufacturing the GaN wafer according to an embodiment, an etch stop layer is formed on a substrate, and a first GaN layer is formed on the etch stop layer. A portion of the first GaN layer is etched with a silane gas, and a second GaN layer is formed on the etched first GaN layer. A third GaN layer is formed on the second GaN layer.
Abstract:
An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate.
Abstract:
A linear type vibration motor having a magnet casing is disclosed. The linear type vibration motor in accordance with an embodiment of the present invention includes a magnet assembly having a pair of magnets, in which same magnetic poles thereof face each other, a magnet casing, which has a hollow part formed therein and houses the magnet assembly in the hollow part, a base, which has a bobbin formed thereon and in which the magnet casing is inserted into the bobbin, a coil, which is coupled to the bobbin, a weight, which is coupled to both ends of the magnet casing, and a pair of elastic bodies, which are interposed between either end of the base and either end of the weight, respectively. Thus, the operating lifetime of the linear type vibration motor can be extended, and this arrangement can prevent the linear type vibration motor from being damaged by an external shock.