Abstract:
An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
Abstract:
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate.
Abstract:
A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.
Abstract:
An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure includes a circuit board implementing an array of bus nodes, each corresponding to a separate one of the I/O pads. The circuit board includes at least two layers. Traces mounted on a first layer form a set of first daisy-chain buses, each linking all bus nodes of a separate row of the bus node array. Traces mounted on a second circuit board layer form a set of second daisy-chain buses, each linking all bus nodes of a separate column of the bus node array. Vias and other circuit board interconnect ends of the first and second daisy-chain buses so that they form the closed-grid bus. Each bus node is connected though a separate isolation resistor to a separate contact pad mounted on a surface of the circuit board. A set of spring contacts or probes link each contact pad to a separate one of the I/O pads on the wafer.
Abstract:
A probe board provides signal paths between an integrated circuit (IC) tester and probes accessing terminals on the surfaces of ICs formed on a semiconductor wafer for receiving test signals form the IC tester. A branching signal path within the probe board distributes a test signal produced by one channel of the IC tester to several probes. Resistors within the branching signal path resistively isolate the probes from one another so that a fault occurring at any one IC terminal will not affect the logic state of the test signal arriving at any other IC terminal. The isolation resistors are sized relative to signal path characteristic impedances so as to substantially minimize test signal reflections at the branch points.
Abstract:
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Abstract:
What is disclosed is a system for testing a plurality of integrated circuit devices under test (DUTs), that includes a tester having at least one set of tester input/output (I/O) lines, the tester providing data values for testing a single DUT on the set of tester I/O lines, and circuitry coupled to the set of tester I/O lines to receive the data values from the tester and to provide error values to the tester, the circuitry forwards the data values to each of the plurality of DUTs, the circuitry performs a first comparison of the values of two locations having corresponding addresses in different DUTs after reading from the locations, and in response generates the error values indicative of the first comparison. The circuitry may further perform a second comparison of the values of two different locations in the same DUT to generate further error values indicative of the second comparison.
Abstract:
A system for distributing synchronized clock signals to spatially distributed circuits includes a pair of transmission lines, each extending between first and second sites. The transmission lines are interconnected at the second site so that an outgoing clock signal traveling on the first transmission line from the first site to the second site returns to the first site on the second transmission line. Spatially distributed deskewing circuits tap the signal transmission lines between the first and second sites. A first delay circuit in each deskewing circuit detects the outgoing clock signal on the first transmission line and produces a local clock signal that lags the outgoing clock signal by an adjustable delay time. A similar second delay circuit in each deskewing circuit delays the local clock signal by a similar adjustable delay time to produce a local reference signal. A phase lock controller in each deskewing circuit adjusts the delay times of the delay circuits so that the local reference signal is phase locked to the returning clock signal on the second transmission line. When reference signals in all deskewing circuits are phase locked to the returning clock signal, their local clock signals have similar phases regardless of the spatial distribution of the deskewing circuits that generate them.
Abstract:
A system for distributing synchronous clock signals includes a set of spatially distributed deskewing stages. Each stage includes matching adjustable first and second delay circuits and a phase lock loop controller. Matching pairs of transmission lines interconnect successive stages of the set. One transmission line of each pair connects the output of the first delay circuit of each stage to the input of the first delay circuit of a next stage of the set. The other transmission line of the pair connects the input of the second delay circuit of the stage to the input of the first delay circuit of the next stage. When the first delay circuit of the first stage of the set receives an input reference clock signal, that reference clock signal propagates through all the first delay circuits of each stage in succession. Whenever the input reference clock signal reaches a stage, it also travels back to the second delay circuit of the preceding stage. The phase lock loop controller in each stage adjusts the similar delay provided by its first and second delay circuits to phase lock the output second delay circuit to the input of the first delay circuit. Each stage also includes a frequency multiplier for doubling the frequency of its first input signal thereby to produce one of the spatially distributed local clock signals.