公开(公告)号：US20140182397A1

公开(公告)日：2014-07-03

申请号：US14108176

申请日：2013-12-16

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi WU ,  Hsuan-Jen SHEN ,  Chien-Ming CHEN ,  Chin-Yi OU YANG

IPC: G01R31/28 ,  G01N1/42

CPC classification number: G01R31/2877 ,  G01N1/42 ,  G01R31/2865

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。

公开(公告)号：US20230400506A1

公开(公告)日：2023-12-14

申请号：US18316691

申请日：2023-05-12

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi OUYANG ,  I-Ching TSAI ,  Xin-Yi WU ,  Yan-Lin WU

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2863

Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

公开(公告)号：US20230375615A1

公开(公告)日：2023-11-23

申请号：US18054197

申请日：2022-11-10

Applicant: CHROMA ATE INC.

Inventor： I-Shih TSENG ,  Xin-Yi WU ,  Chin-Yi OUYANG

IPC: G01R31/28 ,  G01R1/44 ,  G01R35/00

CPC classification number: G01R31/2891 ,  G01R1/44 ,  G01R35/00

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

公开(公告)号：US20230022501A1

公开(公告)日：2023-01-26

申请号：US17834035

申请日：2022-06-07

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi OUYANG ,  Chien-Ming CHEN ,  Wei-Cheng KUO ,  Xin-Yi WU ,  Iching TSAI

IPC: G01R31/28 ,  G01R1/04

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

公开(公告)号：US20180024162A1

公开(公告)日：2018-01-25

申请号：US15628069

申请日：2017-06-20

Applicant: CHROMA ATE INC.

Inventor： Chia-Hung CHIEN ,  Xin-Yi WU

IPC: G01R1/04 ,  G05D23/19 ,  G01R31/28

CPC classification number: G01R1/0458 ,  G01R1/44 ,  G01R31/2891 ,  G05D23/1919 ,  G05D23/24

Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.