Abstract:
In general, a pressure rail having a top surface and a bottom surface and one or more pressure inlets to a pressure channel can be located within the pressure rail. The pressure channel can be drilled into the pressure rail. A plurality of patch depressions can be formed into a plurality of sealing surfaces on the top surface of the pressure rail upon which a patch is positioned. A plurality of antenna blocks is generally disposed upon the pressure rail, wherein each antenna block thereof includes at least two antennas. Two antennas can be connected to a respective antenna block among the plurality of antenna blocks utilizing a silicone adhesive. Each antenna block is respectively located on the pressure rail in order to provide wireless data indicative of pressure and temperature conditions associated with each patch among the plurality of patches.
Abstract:
A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A flanged area or flanged portion can also be connected to the bottom portion of the cover. The flanged area provides a surface for contacting a fixture to which the sensor apparatus attaches and holding the sensor apparatus to the fixture in a manner which prevents the sensor diaphragm from contacting the fixture and inducing errors during sensor operations thereof. The cover also can include a flanged or brim-shaped portion which is connected to and surrounds the bottom portion of the cover. The flanged portion can be positioned parallel to the sensor diaphragm.
Abstract:
A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.
Abstract:
The SAW sensor in a stainless steel button package having a diaphragm and mounted on a threaded port. Package can hermetically seal a sensor and RFID-antenna assemblies from media. Sensor diaphragm is exposable to media. Sensor and RFID antennas communicate electrically with SAW sensor and RFID device, respectively, for sensor measurements and identification. Antennas receive RF interrogation signal from a nearby interrogator/transceiver and send reflected RF signals back to the interrogator unit containing sensor measurement and sensor ID. TRF signal excites a SAW resonator inside the sensor and causes the SAW to resonate wherein resonant frequency changes with pressure and temperature applied to the sensor. Antennas could be printed circuit board antennas, helical antennas, loop antennas, any other commercially available off-the-shelf antennas or a combination of these.
Abstract:
A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.
Abstract:
A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.
Abstract:
A wireless sensor fixture system and method are disclosed in which an antenna block is provided that includes a plurality of grooves, wherein such grooves maintain a plurality of antennas located on a portion of the antenna block. A top locator block can be positioned above the antenna block, wherein the top locator comprises a top surface having depression thereon for receiving and locating a patch, which can receives wireless signals from the antennas for sensor testing thereof, wherein the patch comprises a SAW sensor and an RFID tag over-molded into the patch. Additionally, an antenna cover can be connected to the antenna block for protecting the plurality of antennas and wiring thereof. A BNC connector protrudes from the antenna block and is electrically connected to the plurality of antennas via the wiring thereof.
Abstract:
A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.
Abstract:
A photosensor is provided with a control circuit that is capable of varying the frequency of light pulses which energize a light source of the sensor. When four consecutive light pulses result in an identical status of a light sensitive component, the frequency of light pulses is slowed to conserve energy. However, when a change in state is recognized by the circuitry of the present invention, the frequency of light pulses is increased in order to more rapidly determine whether or not a change of status has actually occurred. This permits the photoelectric sensor to conserve energy while also being able to rapidly determine whether or not the light path of the photoelectric sensor has changed state from obstructed to unobstructed or, conversely, from unobstructed to obstructed.
Abstract:
A voltage regulator circuit is provided for a sensor that is connected in a two-wire scheme to a circuit comprising a power supply and a load. The circuit regulates the current flowing through the load when the sensor output is inactive and provides power to the sensor during periods of time when the input power of the regulator circuit is insufficient to do so. A current monitor and a voltage monitor are provided which utilize common circuit elements to control the current flowing through the circuit. The operational characteristics of a MOSFET device are used advantageously to control the magnitude of current flowing through the sensor and regulate the current as a function of both the magnitude of current and the magnitude of a voltage potential across a bulk capacitor.