FOLDING DEVICE AND FOLDING METHOD
    11.
    发明申请

    公开(公告)号:US20220339855A1

    公开(公告)日:2022-10-27

    申请号:US17761039

    申请日:2021-05-18

    Abstract: A folding device and a folding method are provided. The folding device includes a bearing and fixing mechanism configured to bear and fix a main body portion of a to-be-folded device; a folding mechanism disposed on at least one lateral side of the bearing and fixing mechanism, the folding mechanism being configured to bear a to-be-folded portion of the to-be-folded device and fold the to-be-folded portion to one side in a thickness direction of the main body portion; a first driving mechanism configured to drive the folding mechanism to move along a direction perpendicular to a bearing surface, which bears the main body portion, of the bearing and fixing mechanism; and a second driving mechanism configured to drive the folding mechanism to move close to or away from the bearing and fixing mechanism along a direction parallel to the bearing surface.

    ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND BACKLIGHT MODULE

    公开(公告)号:US20220310660A1

    公开(公告)日:2022-09-29

    申请号:US17418945

    申请日:2020-09-18

    Abstract: The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.

    DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20220028898A1

    公开(公告)日:2022-01-27

    申请号:US17354007

    申请日:2021-06-22

    Abstract: The present disclosure provides a driving substrate including: a flexible substrate base, a plurality of thin film transistors on the flexible substrate base and a first conductive pattern layer on a side of the thin film transistors distal to the flexible substrate base. The first conductive pattern layer includes: a plurality of first connection terminals in the display region and a plurality of signal supply lines in the bendable region. A first number of first connection terminals are electrically coupled to first electrodes of the plurality of thin film transistors. The plurality of signal supply lines are coupled to a second number of first connection terminals other than the first number of first connection terminals. At least one inorganic insulating layer including a hollowed-out pattern in the bendable region is between the first conductive pattern layer and the flexible substrate base.

    LED DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY PANEL

    公开(公告)号:US20220393087A1

    公开(公告)日:2022-12-08

    申请号:US17775959

    申请日:2021-05-20

    Abstract: The present disclosure provides a display substrate, including: a base substrate including a display area and a bonding area; a first metal conductive layer pattern on the base substrate; a first passivation layer on the first metal conductive layer pattern; a second metal conductive layer pattern on the first passivation layer; a second passivation layer on the second metal conductive layer pattern; a first blackening layer pattern is disposed between the first metal conductive layer pattern and the first passivation layer, an orthographic projection of which on the base substrate is located in that of the first metal conductive layer pattern on the base substrate; and/or a second blackening layer pattern is disposed between the second metal conductive layer pattern and the second passivation layer, an orthographic projection of which on the base substrate is located in that of the second metal conductive layer pattern on the base substrate.

    FOLDING DEVICE
    18.
    发明申请

    公开(公告)号:US20220250870A1

    公开(公告)日:2022-08-11

    申请号:US17631090

    申请日:2021-04-09

    Abstract: A folding device is provided, The folding device includes a bearing and fixing mechanism (1) configured to bear and fix a main body portion (21) of a to-be-folded device (2); a folding mechanism (3) located on at least one side of the bearing and fixing mechanism (1), the folding mechanism (3) being rotatably connected to the bearing and fixing mechanism (1) and configured to bear and fix a to-be-folded portion (22) of the to-be-folded device (2); and a driving mechanism (4) connected to the folding mechanism (3), the driving mechanism (4) being configured to drive the folding mechanism (3) to turn relative to the bearing and fixing mechanism (1), so as to fold the to-be-folded portion (22) to a side in a thickness direction of the main body portion (21), The folding device can fold automatically, and manual folding is avoided.

    METHOD OF FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE

    公开(公告)号:US20210280615A1

    公开(公告)日:2021-09-09

    申请号:US17328393

    申请日:2021-05-24

    Inventor: Wei YANG Xinhong LU

    Abstract: A display device is disclosed. The display device includes a display area and a wiring area. The display area is disposed with a first thin film transistor which is an oxide thin film transistor and a second thin film transistor which is a low temperature poly-silicon thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor includes first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove includes a first sub-groove and a second sub-groove that are stacked, and depths of the second vias are substantially equal to a depth of the second sub-groove.

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