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公开(公告)号:US20220304154A1
公开(公告)日:2022-09-22
申请号:US17428628
申请日:2020-10-22
Inventor: Donghui Tian , Bo Zhang , Zhiwen Chu , Rong Wang , Yulong Wei
IPC: H05K1/11
Abstract: A display panel having a bonding region for bonding a flexible printed circuit in a peripheral region is provided. The display panel includes a plurality of first signal lines on a base substrate; and a plurality of bonding pins on the base substrate and in the bonding region. The plurality of bonding pins include a plurality of first bonding pins respectively electrically connected to the plurality of first signal lines. The display panel further includes a plurality of connecting portions respectively connecting the plurality of first signal lines portions to the plurality of first bonding pin portions. A respective one of the plurality of first bonding pin portions and a respective one of the plurality of connecting portions are substantially parallel to each other, and are arranged at a substantially same inclined angle with respect to a respective one of the plurality of first signal line portions.
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公开(公告)号:US11183467B2
公开(公告)日:2021-11-23
申请号:US16029276
申请日:2018-07-06
Inventor: Chunghao Cheng , Bo Zhang , Bin Zhao
Abstract: A flexible circuit board, a display device and a method for mounting a flexible circuit board are disclosed. The flexible circuit board includes: a bendable portion, the flexible circuit board being bendable at the bendable portion to go into a bent state so as to be connected to a workpiece; and at least one opening in the bendable portion. In response to the bent state, a gap is formed between the bendable portion and the workpiece, and the at least one opening is in communication with the gap.
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公开(公告)号:US11126036B2
公开(公告)日:2021-09-21
申请号:US16820771
申请日:2020-03-17
Inventor: Jiang Zhu , Hongchao He , Jianghui Zhan , Rui Wang , Yuxi Dong , Changjun Zhang , Bo Zhang , Dan Liu , Tongmin Liu
IPC: G02F1/13357
Abstract: The present disclosure provides a backlight module assembly, structural adjustment method thereof and display device. The backlight module assembly includes a plastic frame, a film and an adjustment sheet. The plastic frame is presented in a box shape with an opening on the top, and has side walls and a bottom wall, and a space enclosed by the side walls and the bottom wall being a mounting groove. The film is arranged on the bottom wall and received within the mounting groove. The adjustment sheet is arranged on an inner side of the side wall of the mounting groove.
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公开(公告)号:US10458636B2
公开(公告)日:2019-10-29
申请号:US15577298
申请日:2017-06-07
Applicant: Boe Technology Group Co., Ltd.
Inventor: Bo Zhang
IPC: F21V23/00 , F21Y115/10 , F21Y107/20 , F21Y115/30 , F21Y115/15
Abstract: The present invention provides a backlight source for use in a display device, comprising: a substrate; a plurality of carriers arranged on the substrate in an array, the carrier comprising a bottom surface in contact with the substrate, a top surface parallel to the substrate and a side surface connected between the top surface and the bottom surface; light emitting elements arranged on the carrier, comprising at least one first light emitting element arranged on the top surface of the carrier for emitting collimated light perpendicular to the substrate, and at least one second light emitting element arranged on the side surface of the carrier for emitting scattered light to a plurality of angles; and a controller, configured to control at least one first light emitting element to turn on and all second light emitting elements to turn off in response to a first display mode of the display device and to control at last one first light emitting element to turn on and at least one second light emitting element to turn on in response to a second display mode of the display device. The backlight source of the present invention can realize anti-peeping display of the display and switching between the anti-peeping display and normal display.
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公开(公告)号:US10396245B2
公开(公告)日:2019-08-27
申请号:US15545176
申请日:2017-02-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Bo Zhang
IPC: H01L51/50 , H01L33/36 , H01L33/00 , H01L27/15 , H01L33/08 , H01L33/14 , H01L25/075 , H01L33/62 , H01L33/58
Abstract: The present invention discloses a light emitting element and a fabrication method thereof. The light emitting element includes: an anode electrode, a hole transport layer, a light emitting layer, an electron transport layer and a cathode electrode, all of the light emitting units are divided into a plurality of light emitting sets, each light emitting set includes at least two light emitting units and the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode. In the technical solutions of the present invention, all of the light emitting units in a same light emitting set share a same electron transport layer and a same cathode electrode, thus effectively reducing the number of the cathode electrodes.
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公开(公告)号:US10221345B2
公开(公告)日:2019-03-05
申请号:US15560419
申请日:2017-03-30
Inventor: Bo Zhang , Cong Tan , Chengyong Zhan
IPC: C09J163/00 , G02F1/1339 , C08G59/14 , C09K3/10 , C09J11/06
Abstract: Disclosed are a sealing adhesive and a method of making the same, and a liquid crystal display device. The sealing adhesive includes a modified epoxy compound obtained by chemical bonding of a piperidine compound with an epoxy compound, wherein the modified epoxy compound contains a nitrogen-hydrogen bond. The method of preparing the above sealing adhesive includes: subjecting a piperidine compound and an epoxy compound to a chemical reaction to obtain a modified epoxy compound; and mixing about 10 to 90 parts by eight of the modified epoxy compound, about 10 to 90 parts by weight of an acrylic resin, about 2 to 5 parts by weight of a filler, about 5 to 10 parts by weight of a heat curing agent and about 3 to 10 parts by weight of a photoinitiator to obtain a sealing adhesive. The liquid crystal display device includes the sealing adhesive described above.
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公开(公告)号:US10107925B2
公开(公告)日:2018-10-23
申请号:US15544904
申请日:2017-02-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Bo Zhang
Abstract: The present disclosure provides a smart terminal, including a radioactive detector, a communication device, an interactive device and a processor. The radioactivity detector is configured to detect a radioactive parameter and send a detection value of the radioactive parameter to the processor. The interactive device is configured to receive an operation instruction of a user and send the operation instruction to the processor. The communication device is configured to establish a connection and pair with a mobile terminal having a wireless communication function through a short range wireless communication mode. The processor is configured to establish a mapping between the interactive device of the smart terminal and an interactive device of the mobile terminal, and remotely control the interactive device of the mobile terminal according to the operation instruction received by the interactive device of the smart terminal.
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18.
公开(公告)号:US10008690B2
公开(公告)日:2018-06-26
申请号:US14743472
申请日:2015-06-18
Inventor: Zhiliang Jiang , Minghua Xuan , Renrong Gai , Bo Zhang , Fei Chen
IPC: C03C25/68 , H01L51/52 , H01L21/428 , H01L21/02 , H01L21/449
CPC classification number: H01L51/5246 , H01L21/02675 , H01L21/02686 , H01L21/428 , H01L21/449
Abstract: The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.
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公开(公告)号:US09966340B2
公开(公告)日:2018-05-08
申请号:US15319565
申请日:2016-02-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L23/06 , H01L23/538 , H01L23/00 , H01L25/065
CPC classification number: H01L23/5387 , G09F9/301 , H01L23/5386 , H01L23/562 , H01L25/0655 , H01L27/12 , H05K1/028 , H05K2201/09263 , H05K2201/10287
Abstract: The present invention provides a flexible substrate for packaging and a package. The flexible substrate for packaging includes a bendable region provided in a central region of the flexible substrate; chips provided at both sides of the bendable region and at both ends of the flexible substrate, respectively; and a wire provided to be connected between the chips and to pass through the bendable region. A portion of the wire corresponding to the bendable region is provided with an anti-stress structure, and the anti-stress structure is configured to release a tensile resistance and a compressive resistance when the bendable region is bent.
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公开(公告)号:US20170139244A1
公开(公告)日:2017-05-18
申请号:US15105288
申请日:2015-10-15
Inventor: Bo Zhang , Cong Tan , Chengyong Zhan , Fangfang Li , Kai Wang
IPC: G02F1/1339 , G02F1/1335
CPC classification number: G02F1/1339 , G02F1/133504 , G02F1/133512 , G02F1/133514 , G02F2203/11
Abstract: This present invention provides a display panel, a method for curing a sealant thereof, and a display apparatus. This display panel comprises a first substrate and a second substrate, which are oppositely provided, and a sealant structure for binding the first substrate and the second substrate, wherein the sealant structure comprises a sealant and a conversion unit, and the conversion unit is used for converting infrared light, which irradiates it when the sealant is being cured, to ultraviolet light. With respect to the display panel provided by the invention, photocuring and thermocuring are achieved with a one-step process by providing a conversion unit in the sealant structure so as to prevent the problems in liquid crystal contamination, puncture, and the like, for the reason that the incompletely pre-cured sealant is prone to become in contact with liquid crystal, when ultraviolet photocuring and thermocuring are performed on a sealant separately.
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