公开(公告)号：US12222451B2

公开(公告)日：2025-02-11

申请号：US18184260

申请日：2023-03-15

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Lei Wang

IPC: G01S7/481 ,  F21V8/00 ,  G01S17/86 ,  G01S17/931 ,  G02B6/02 ,  G02F1/01

Abstract: A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.

公开(公告)号：US12222448B1

公开(公告)日：2025-02-11

申请号：US18516671

申请日：2023-11-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Sen Lin ,  Dong Liu ,  Xue Liu ,  Andrew Steil Michaels

IPC: G01S7/481 ,  G01S17/931 ,  H01L31/0352

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die including a substrate having two or more semiconductor stacks respectively associated with two or more semiconductor devices formed on the substrate, the two or more semiconductor devices respectively configured to receive the beam from the light source and modify one or more features of the beam; a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object.

公开(公告)号：US20250035869A1

公开(公告)日：2025-01-30

申请号：US18359127

申请日：2023-07-26

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Stefan Heinemann ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Zhizhong Tang

IPC: G02B6/42 ,  G01S17/931

Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

公开(公告)号：US12199411B2

公开(公告)日：2025-01-14

申请号：US18486208

申请日：2023-10-13

Applicant: Aurora Operations, Inc.

Inventor： Andrew Steil Michaels ,  Lei Wang ,  Sen Lin

IPC: H01S5/40 ,  B60R16/02 ,  G01S7/481 ,  G01S17/08 ,  G01S17/32 ,  G02B6/12 ,  G02B6/42 ,  H01S3/08 ,  H01S5/026

Abstract: A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.

公开(公告)号：US12199401B1

公开(公告)日：2025-01-14

申请号：US18511387

申请日：2023-11-16

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Xue Liu ,  Andrew Steil Michaels ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S17/88 ,  G02B6/122 ,  H01S5/00 ,  G02B6/12

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.

公开(公告)号：US12181606B2

公开(公告)日：2024-12-31

申请号：US17870493

申请日：2022-07-21

Applicant: Aurora Operations, Inc.

Inventor： Andrew Steil Michaels ,  Sen Lin

IPC: G01S7/481 ,  B60W60/00 ,  G01S7/4911 ,  G01S17/931 ,  G02F1/01

Abstract: A light detection and ranging (LIDAR) pixel includes a splitter, a grating coupler, and a phase shifter. The grating coupler is configured to emit a transmit beam that is based on a combination of a first portion of light and a second portion of light received from a laser. One or more first interconnects and one or more second interconnects couple the splitter to the grating coupler. The phase shifter is coupled to the one or more first interconnects and configured to vary a phase of the first portion of the light relative to a phase of the second portion of the light.

公开(公告)号：US12099120B2

公开(公告)日：2024-09-24

申请号：US17054242

申请日：2019-05-10

Applicant: Aurora Operations, Inc.

Inventor： Phillip Sandborn ,  Sen Lin

IPC: G01S17/58 ,  G01S7/481 ,  G01S7/491 ,  G01S17/34 ,  G01S17/95

CPC classification number: G01S17/34 ,  G01S7/4817 ,  G01S7/491 ,  G01S17/58 ,  G01S17/95 ,  G01S7/4815

Abstract: A LIDAR system and method for determining a distance and a velocity of a target. The LIDAR system can include laser bank (62) is configured to generate a laser field from a first laser beam having a positive frequency sweep and a second laser beam having a negative frequency sweep, an optical combiner (65), an optical coupler (63), a photoreceiver (66), and a control circuit (69). The optical coupler direct a first portion of the laser field at the target such that the first portion is reflected by the target to the optical combiner. The optical combiner can optically combine the portions of the laser field. The output an 1-output (67) and a Q-output (68) according to the optically combined portions of the laser field. The control circuit can determine a nominal beat frequency, which corresponds to the distance of the target, and a frequency shift, which corresponds to the velocity of the target, accordingly.

公开(公告)号：US11927702B2

公开(公告)日：2024-03-12

申请号：US18099170

申请日：2023-01-19

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/499 ,  G01S7/48 ,  G01S7/481 ,  G01S7/4863 ,  G01S17/931

CPC classification number: G01S7/499 ,  G01S7/4816 ,  G01S7/4863 ,  G01S17/931

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle includes one or more LIDAR pixels. At least one of the one or more LIDAR pixels includes a dual-polarization optical antenna, a second optical antenna, and one or more receivers. The dual-polarization optical antenna is configured to emit a transmit beam having a first polarization orientation, and detect a return beam having a second polarization orientation. The second optical antenna is offset from the dual-polarization optical antenna by a particular distance, and is configured to detect the return beam having the second polarization orientation. The one or more receivers are configured to generate one or more signals in response to detecting the second polarization orientation of the return beam.

公开(公告)号：US11415673B1

公开(公告)日：2022-08-16

申请号：US17535013

申请日：2021-11-24

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/48 ,  G01S7/481 ,  G01S17/931

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

公开(公告)号：US20240192343A1

公开(公告)日：2024-06-13

申请号：US18427016

申请日：2024-01-30

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/499 ,  G01S7/481 ,  G01S7/4863 ,  G01S17/931

CPC classification number: G01S7/499 ,  G01S7/4816 ,  G01S7/4863 ,  G01S17/931

Abstract: A light detection and ranging (LIDAR) sensor system includes a dual-polarization optical antenna, a single-polarization optical antenna, a first receiver, and a second receiver. The dual-polarization optical antenna is configured to (i) emit a transmit beam with a first polarization orientation and (ii) and detect a return beam having a second polarization orientation. The single-polarization optical antenna is configured to detect the return beam having the second polarization orientation.