公开(公告)号：US20240114727A1

公开(公告)日：2024-04-04

申请号：US18528888

申请日：2023-12-05

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20230269969A1

公开(公告)日：2023-08-24

申请号：US18040161

申请日：2021-07-27

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Seong Ho YOO ,  Dieter HAAS ,  Si Kyoung KIM ,  Yu-hsin LIN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

CPC classification number: H10K59/122 ,  H10K59/873 ,  H10K59/1201

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

公开(公告)号：US20240268205A1

公开(公告)日：2024-08-08

申请号：US18431001

申请日：2024-02-02

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Chung-chia CHEN ,  Jungmin LEE ,  Yu-hsin LIN ,  Takuji KATO

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/122

CPC classification number: H10K59/8794 ,  H10K59/1201 ,  H10K59/122 ,  H10K59/80521

Abstract: Devices with sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, a plurality of pixel-defining layer (PDL) structures disposed over the substrate, each PDL structure having an upper PDL surface, and a plurality of heat absorbent structures disposed on the upper PDL surface of the plurality PDL structures. Each adjacent heat absorbent structure includes a top surface and two sidewalls. Adjacent heat absorbent structures define sub-pixels of the device, each sub-pixel includes an anode, an OLED material disposed over the anode, a cathode disposed over the OLED material, and an encapsulation layer disposed over the cathode and over a first portion of the top surface of the first heat absorbent structure and a second portion of the top surface of the second heat absorbent structure.

公开(公告)号：US20240121995A1

公开(公告)日：2024-04-11

申请号：US18545709

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20240107819A1

公开(公告)日：2024-03-28

申请号：US18528906

申请日：2023-12-05

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20240040831A1

公开(公告)日：2024-02-01

申请号：US18363574

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/121 ,  H10K59/65 ,  H10K59/12

CPC classification number: H10K59/121 ,  H10K59/65 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.

公开(公告)号：US20230255064A1

公开(公告)日：2023-08-10

申请号：US18301805

申请日：2023-04-17

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US20230041252A1

公开(公告)日：2023-02-09

申请号：US17881358

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.