公开(公告)号：US20220163792A1

公开(公告)日：2022-05-26

申请号：US17307154

申请日：2021-05-04

Applicant: Applied Materials, Inc.

Inventor： Benjamin B. Riordon ,  Kangkang Wang

IPC: G02B27/00 ,  B08B11/02 ,  B08B3/12

Abstract: Embodiments of the present disclosure relate to a carrier mechanism for retaining optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that a plurality of optical device lenses are retained therebetween. The carrier mechanism retains the plurality of optical device lenses without damaging the plurality of optical device lenses by contacting corners of the optical device lenses. The plurality of optical device lenses are retained with a plurality of support pins and a plurality of capture pins disposed in the tray assemblies. Each tray includes a plurality of openings corresponding to the plurality of optical device lenses such that fluids may contact the plurality of optical device lenses. The carrier mechanism may be utilized in multiple processing methods of the plurality of optical device lenses.

公开(公告)号：US11315806B2

公开(公告)日：2022-04-26

申请号：US16400516

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David Blahnik ,  William T. Weaver

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/673 ,  H01L21/687

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

公开(公告)号：US20190019708A1

公开(公告)日：2019-01-17

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67754 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68764 ,  H01L21/68771

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10103046B2

公开(公告)日：2018-10-16

申请号：US15099760

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US12084761B2

公开(公告)日：2024-09-10

申请号：US18111385

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Karl J. Armstrong ,  Ludovic Godet ,  Brian Alexander Cohen ,  Wayne McMillan ,  James D. Strassner ,  Benjamin B. Riordon

IPC: H01L21/677 ,  C23C14/04 ,  C23C14/06 ,  C23C14/08 ,  C23C14/14 ,  C23C16/04 ,  C23C16/24 ,  C23C16/34 ,  C23C16/40 ,  C23C16/455 ,  C23C16/56 ,  H01L21/68 ,  H01L21/683 ,  G02B6/132

CPC classification number: C23C16/405 ,  C23C14/042 ,  C23C14/0652 ,  C23C14/083 ,  C23C14/086 ,  C23C14/14 ,  C23C16/042 ,  C23C16/24 ,  C23C16/345 ,  C23C16/407 ,  C23C16/45525 ,  C23C16/56 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/682 ,  H01L21/6838 ,  G02B6/132

Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.

公开(公告)号：US11715662B2

公开(公告)日：2023-08-01

申请号：US17119382

申请日：2020-12-11

Applicant: Applied Materials, Inc.

Inventor： Benjamin B. Riordon ,  James D. Strassner

IPC: H01L21/683 ,  C23C16/458 ,  C23C16/04 ,  H01L21/687 ,  H01L21/02 ,  B05C21/00 ,  C23C14/04

CPC classification number: H01L21/6838 ,  B05C21/005 ,  C23C14/042 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/02266 ,  H01L21/68721

Abstract: Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.

公开(公告)号：US11698506B2

公开(公告)日：2023-07-11

申请号：US17307154

申请日：2021-05-04

Applicant: Applied Materials, Inc.

Inventor： Benjamin B. Riordon ,  Kangkang Wang

IPC: G02B7/00

CPC classification number: G02B7/00

Abstract: Embodiments of the present disclosure relate to a carrier mechanism for retaining optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that a plurality of optical device lenses are retained therebetween. The carrier mechanism retains the plurality of optical device lenses without damaging the plurality of optical device lenses by contacting corners of the optical device lenses. The plurality of optical device lenses are retained with a plurality of support pins and a plurality of capture pins disposed in the tray assemblies. Each tray includes a plurality of openings corresponding to the plurality of optical device lenses such that fluids may contact the plurality of optical device lenses. The carrier mechanism may be utilized in multiple processing methods of the plurality of optical device lenses.

公开(公告)号：US11264258B2

公开(公告)日：2022-03-01

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20200279763A1

公开(公告)日：2020-09-03

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10699930B2

公开(公告)日：2020-06-30

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.