公开(公告)号：US20240074066A1

公开(公告)日：2024-02-29

申请号：US18144031

申请日：2023-05-05

Applicant: Apple Inc.

Inventor： Nitesh KUMBHAT ,  Yanfeng Chen ,  Mandar S. Painaik ,  Shankar S. Pennathur ,  Pierpaolo Lupo

IPC: H05K3/28 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L21/565 ,  H05K2203/1316

Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.

公开(公告)号：US10356903B1

公开(公告)日：2019-07-16

申请号：US15939097

申请日：2018-03-28

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US10147685B2

公开(公告)日：2018-12-04

申请号：US15403046

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Phillip R. Sommer ,  Shankar Pennathur ,  Meng Chi Lee ,  Shakti S. Chauhan ,  Yanfeng Chen

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/285 ,  H01L21/268 ,  H01L23/00 ,  H01L21/56

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

公开(公告)号：US20250105228A1

公开(公告)日：2025-03-27

申请号：US18475054

申请日：2023-09-26

Applicant: Apple Inc.

Inventor： Kyusang Kim ,  David M Kindlon ,  Kishore N Renjan ,  Manoj Vadeentavida ,  Bilal Mohamed Ibrahim Kani ,  Benjamin J Grena ,  Ali N Ergun ,  Jerzy S Guterman ,  Jee Tung Tan ,  Steven Webster ,  Parin R Dedhia ,  Howell John Chua Toc ,  Mandar S Painaik ,  Abhay Maheshwari ,  Wyeman Chen ,  Yanfeng Chen ,  Andrew N Leopold ,  Jun Zhang ,  Dhruv Gaba

IPC: H01L25/16

Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

公开(公告)号：US10966321B2

公开(公告)日：2021-03-30

申请号：US16894463

申请日：2020-06-05

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H01L25/11 ,  H05K3/46 ,  H01L23/00 ,  H05K1/18

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20200154561A1

公开(公告)日：2020-05-14

申请号：US16720666

申请日：2019-12-19

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

公开(公告)号：US09949359B2

公开(公告)日：2018-04-17

申请号：US14308463

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K1/18 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28 ,  H05K3/30 ,  H05K7/00

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.