Electronic Devices Having Quantum Film Infrared Sensors

    公开(公告)号:US20230087411A1

    公开(公告)日:2023-03-23

    申请号:US17483660

    申请日:2021-09-23

    申请人: Apple Inc.

    IPC分类号: H01L25/16

    摘要: An electronic device may include an infrared sensor with light sources and a quantum film photodetector. The light sources may emit short-wavelength infrared (SWIR) light through a display panel and the photodetector may receive the SWIR light through the panel after reflection off an object. The light sources and an integrated circuit may be mounted to a wall of a sensor module mounted to the panel. The module may include a lens. The photodetector may be disposed onto the rear wall, lens, integrated circuit, or display panel. The photodetector may include multiple types of quantum film to absorb different wavelengths of SWIR light. The SWIR light may pass through the display panel without distorting images emitted by the display panel. Using a quantum film in the photodetector may allow the photodetector to extend across a large surface area without unnecessarily increasing manufacturing cost for the device.

    Dual resistive strain and pressure sensor for force touch

    公开(公告)号:US10353506B2

    公开(公告)日:2019-07-16

    申请号:US15625952

    申请日:2017-06-16

    申请人: Apple Inc.

    IPC分类号: G06F3/041 G06F3/044

    摘要: Structures and methods are disclosed for an electronic device having an input surface that uses dual sensors to measure forces applied to the input surface. The forces can be estimated over a greater range of values than would be possible with either sensor alone. A second sensor can be used after a first sensor has reached a limit. A first sensor can be a strain sensor and a second sensor a pressure sensor. Both sensors may be resistance based, with signals from both sensors can be combined and measured by processing circuitry. Each sensor type may be part of planar arrays disposed beneath the input surface.