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    Mass loaded earbud with vent chamber
    11.
    发明授权
    Mass loaded earbud with vent chamber 有权

    公开(公告)号：US10805713B2

    公开(公告)日：2020-10-13

    申请号：US15924049

    申请日：2018-03-16

    Applicant: Apple Inc.

    Inventor： Yacine Azmi ,  Esge B. Andersen ,  Jonathan S. Aase ,  Michael B. Howes

    IPC: H04R1/10 ,  H04R1/28

    Abstract: Intra-concha earphones are disclosed. In an embodiment, an intra-concha earphone includes a housing having a rear space divided into a back volume, a bass duct, and a vent chamber between a driver and a rear wall. The vent chamber may be acoustically coupled with the back volume through both an acoustic port and the bass duct. Furthermore, the vent chamber may be acoustically coupled with a surrounding environment through a vent port, which may be a sole acoustic opening in the rear wall. Thus, sound emitted by the driver may propagate through the acoustic port and the bass duct to meet in the vent chamber before being discharged through the vent port to the surrounding environment. Other embodiments are also described and claimed.

    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME
    15.
    发明申请
    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME 审中-公开

    公开(公告)号：US20180146274A1

    公开(公告)日：2018-05-24

    申请号：US15829415

    申请日：2017-12-01

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R1/1075 ,  H04R2201/105 ,  H04R2460/09 ,  H04R2460/11 ,  Y10T29/49176

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

    Seamless earbud structures and methods for making the same
    19.
    发明授权
    Seamless earbud structures and methods for making the same 有权

    公开(公告)号：US09838770B2

    公开(公告)日：2017-12-05

    申请号：US15006046

    申请日：2016-01-25

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R1/1075 ,  H04R2201/105 ,  H04R2460/09 ,  H04R2460/11 ,  Y10T29/49176

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

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