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公开(公告)号：US11765838B2
公开(公告)日：2023-09-19
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
CPC classification number: H05K3/363 , H05K1/189 , H05K3/0014 , H05K3/3436 , H05K3/4038 , H05K2201/10151 , H05K2203/048
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US11576262B2
公开(公告)日：2023-02-07
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20210045685A1
公开(公告)日：2021-02-18
申请号：US17088457
申请日：2020-11-03
Applicant: Apple Inc.
Inventor： Steven J. Keating , Daniel D. Sunshine , Benjamin J. Grena , Daniel A. Podhajny , Jerzy S. Guterman , Jessica J. Lu , David M. Kindlon
IPC: A61B5/00 , A61B5/0205 , A61B5/021 , A61B5/024 , A61B5/0408 , A61B5/08 , D03D1/00 , D03D7/00 , D03D15/08 , H04B1/3827 , H04W4/80 , A61B5/01 , A61B5/113 , D02G3/44
Abstract: A fabric-based item may be provide with a stretchable band. The stretchable band may be formed from a ring-shaped strip of stretchable fabric having an opening configured to fit around a body part of a user. Circuitry may be coupled to strands of material in the stretchable band. The circuitry may include sensor circuitry for making measurements on the body part such as electrocardiogram measurements, blood pressure measurements, and respiration rate measurements. Wireless communications circuitry in the fabric-based item may be used to communicate wirelessly with external electronic equipment. A wireless power transmitting device may transmit wireless power. A coil formed from conductive strands in the fabric-based item may be used by wireless power receiving circuitry in the fabric-based item to receive the wireless power. The coil may have one or more turns that run around the ring-shaped strip of stretchable fabric.
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公开(公告)号：US20240417898A1
公开(公告)日：2024-12-19
申请号：US18734475
申请日：2024-06-05
Applicant: Apple Inc.
Inventor： Andrew L. Rosenberg , Kathryn P. Crews , Didio V. Gomes , Benjamin J. Grena , Maurice P. May , Daniel A. Podhajny
Abstract: Knitting equipment may be used to form warp knit fabric. The warp knit fabric may be a spacer fabric having a spacer strand that travels back and forth between outer warp knit layers. The spacer fabric may include a pocket for receiving an electrical component. The electrical component may be mounted to an inlaid conductive strand that floats between the outer warp knit layers and that is held in place by the spacer strand. The pocket may be one of multiple pockets in the spacer fabric that are separated from one another by the spacer strand. Braiding equipment may include carriers that braid strands around an electrical component while a tool holds the electrical component in place. A ring may be used to isolate the braiding angle from the carriers to accommodate component insertion. The electrical component may be mounted to an inlaid conductive strand in the braid.
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公开(公告)号：US20240068135A1
公开(公告)日：2024-02-29
申请号：US18504549
申请日：2023-11-08
Applicant: Apple Inc.
Inventor： Kyle L. Chatham , Kathryn P. Crews , Didio V. Gomes , Benjamin J. Grena , Storrs T. Hoen , Steven J. Keating , David M. Kindlon , Daniel A. Podhajny , Andrew L. Rosenberg , Daniel D. Sunshine , Lia M. Uesato , Joseph B. Walker , Felix Binder , Bertram Wendisch , Martin Latta , Ulrich Schläpfer , Franck Robin , Michael Baumann , Helen Wächter Fischer
CPC classification number: D03D1/0088 , B23K1/0008 , D03D41/00 , D03J1/00 , H05K1/038 , D10B2401/16 , D10B2401/18
Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
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Patent Agency Ranking
公开(公告)号：US11913143B2
公开(公告)日：2024-02-27
申请号：US16809445
申请日：2020-03-04
Applicant: Apple Inc.
Inventor： Kyle L Chatham , Kathryn P. Crews , Didio V. Gomes , Benjamin J. Grena , Storrs T. Hoen , Steven J. Keating , David M. Kindlon , Daniel A. Podhajny , Andrew L. Rosenberg , Daniel D. Sunshine , Lia M. Uesato , Joseph B. Walker , Felix Binder , Bertram Wendisch , Martin Latta , Ulrich Schläpfer , Franck Robin , Michael Baumann , Helen Wächter Fischer
CPC classification number: D03D1/0088 , B23K1/0008 , D03D41/00 , D03J1/00 , H05K1/038 , D10B2401/16 , D10B2401/18
Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
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公开(公告)号：US20230189445A1
公开(公告)日：2023-06-15
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/189 , H05K1/0298 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230056922A1
公开(公告)日：2023-02-23
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H01L25/16 , H01L23/498 , H01R12/79 , H01R13/6581 , H01L23/31 , H01R12/62 , H01L21/56 , H01R43/20 , H01R12/59 , G01D11/24
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20210337671A1
公开(公告)日：2021-10-28
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20210087719A1
公开(公告)日：2021-03-25
申请号：US16985042
申请日：2020-08-04
Applicant: Apple Inc.
Inventor： Benjamin J. Grena , Didio V. Gomes , Joshua A. Hoover , Seul Bi Kim , David M. Kindlon , Kevin T. Pham , Daniel A. Podhajny , Robert J. Rose , Andrew L. Rosenberg , Miikka O. Tikander
IPC: D03D1/00 , B32B5/26 , B32B5/02 , B32B3/08 , D03D7/00 , D03D11/00 , D03D15/08 , D03D17/00 , H01B7/06
Abstract: A stretchable fabric signal path may include a conductive strand located between first and second outer fabric layers. The outer fabric layers may be formed from intertwined strands of elastic material. The conductive strand may have a wavy shape to accommodate stretching of the stretchable fabric signal path. First and second inner fabric layers may be located between the outer stretchable fabric layers. The inner fabric layers may be formed from intertwined strands of non-elastic material. The inner fabric layers may have strands that are intertwined with the outer fabric layers to serve as anchor points for maintaining the shape of the conductive strand as the stretchable fabric signal path expands and contracts. The outer fabric layers and inner fabric layers may be woven. The conductive strand may convey electrical signals such as audio signals, power signals, data signals, or other suitable signals.
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